The image below marks the position of the DDR2 chips that were cut open. We can see that there are dense traces inside the new foam. The BGA solder balls are marked in red. This is a 6-layer board, with the positions of the TOP, BOTTOM, and the four internal electrical layers already indicated. Since … Read more
The development of packaging has evolved from the early DIP to the current 3D ICs [1][2], with a variety of packaging types emerging. Just the QF series has spawned a long list of types such as QFN (no leads), QFP (with leads)… There are many choices in terms of product applications [3], and each type … Read more
When it comes to circuit boards, many people should be familiar with them, as they are ubiquitous in our lives, from small devices like Bluetooth headsets, electronic watches, and calculators to larger systems like computers, communication devices, and military/aerospace systems. Wherever integrated circuits are needed, they rely on PCB to carry electronic components. Before PCB … Read more
Source: Wangcai Chips Original Author: Xiaochao Says Why are some chips pin-packaged while mobile phone chips use bottom BGA ball grid array packaging? The so-called chip actually only has a very small part in the middle; if you look closely at its structure, the chip is facing up, and the internal circuits connect to the … Read more
eMMC, or Embedded Multi Media Card, is defined by the MMC Association. The concept of an embedded multi-media card may be unfamiliar to many. Let’s start by understanding it literally. Since there is an embedded multi-media card, shouldn’t there be a multi-media card? Exactly, you are correct. Moreover, there is a type of card that … Read more
EMMC ISP refers to the flying wire read and write of EMMC chips, communicating by connecting the CMD, CLK, D0, and GND of the EMMC. Due to varying power consumption across different boards, it is recommended that the power supply VCC be provided by the original board, and under this condition, VCC and VCCQ can … Read more