The design of BGA (Ball Grid Array) on PCB boards is very common in the industry, and the issue of irregular BGA sizes can severely affect the soldering quality and electrical performance of PCBs. To effectively improve this issue, it is necessary to address it from the aspects of design and manufacturing processes.1. Package Design1. … Read more
The wiring formation process should include a formal design evaluation of the wiring details, with participation from as many relevant departments as possible within the company, such as manufacturing, assembly, and testing. The wiring scheme approved by representatives from the affected departments ensures that production-related factors have been considered in the design. The success of … Read more
The main purpose of thermal management is to ensure that all electronic components, especially BGA, are maintained within their functional and maximum allowable limits. The functional temperature limit defines the range of environmental temperatures or component package temperatures that allow electronic circuits to operate normally. It is essential to understand the cooling technologies that the … Read more
The design differences of contact points have varying impacts on contact quality and reliability, accessibility, and subsequent solderability, which are negligible for small contact points. 1. Component Testing As the BGA pitch and solder ball size decrease, the design of socket manufacturers faces increasing challenges to adequately test BGA packages. Socket manufacturers are focusing on … Read more
To facilitate rework, it is recommended to provide sufficient spacing (3mm to 5mm) around the BGA. It is advisable to adopt the upper limit of the spacing, especially when CBGA uses a stepped stencil for solder paste deposition and when hot air is used for rework. However, if a diode laser system is used for … Read more
The image below marks the position of the DDR2 chips that were cut open. We can see that there are dense traces inside the new foam. The BGA solder balls are marked in red. This is a 6-layer board, with the positions of the TOP, BOTTOM, and the four internal electrical layers already indicated. Since … Read more
The development of packaging has evolved from the early DIP to the current 3D ICs [1][2], with a variety of packaging types emerging. Just the QF series has spawned a long list of types such as QFN (no leads), QFP (with leads)… There are many choices in terms of product applications [3], and each type … Read more
When it comes to circuit boards, many people should be familiar with them, as they are ubiquitous in our lives, from small devices like Bluetooth headsets, electronic watches, and calculators to larger systems like computers, communication devices, and military/aerospace systems. Wherever integrated circuits are needed, they rely on PCB to carry electronic components. Before PCB … Read more
Source: Wangcai Chips Original Author: Xiaochao Says Why are some chips pin-packaged while mobile phone chips use bottom BGA ball grid array packaging? The so-called chip actually only has a very small part in the middle; if you look closely at its structure, the chip is facing up, and the internal circuits connect to the … Read more
eMMC, or Embedded Multi Media Card, is defined by the MMC Association. The concept of an embedded multi-media card may be unfamiliar to many. Let’s start by understanding it literally. Since there is an embedded multi-media card, shouldn’t there be a multi-media card? Exactly, you are correct. Moreover, there is a type of card that … Read more