📌 Problem Overview BGA components are prone to deformation during the reflow soldering process due to high thermal stress. This deformation can lead to poor contact between BGA solder balls and pads, resulting in cold solder joints, short circuits, or solder joint fractures due to stress concentration in later usage. The following table summarizes the … Read more
The direction of the board entering the wave soldering process should be indicated on the PCB, and the entry direction should be reasonable. If the PCB can enter from two directions, a double arrow entry indication should be used. (For reflow soldering, consider using tooling fixtures to determine the direction of passing through the reflow … Read more
Via holes serve the purpose of connecting circuits, and the development of the electronics industry has also promoted the advancement of PCBs, which in turn raises higher requirements for PCB manufacturing processes and surface mount technology. The via hole plugging process has emerged to meet the following requirements: (1) The via hole must contain copper; … Read more
Many Huhutong set-top boxes now use the BGA-packaged 25Q64 chip. To read and write data for this chip, a dedicated BGA24 programming seat is required. This programming seat directly converts the chip’s BGA pins to DIP pins, and the 8-pin header is compatible with any programmer that supports the 25 series chips, providing great convenience … Read more
Welcome FPGA engineers to join the official WeChat technical group. Clickthe blue textto follow us at FPGA Home – the largest and best FPGA pure engineer community in China. Introduction: Transmission lines define and control characteristic impedance along their length. However, the three-dimensional structure at their interfaces does not have easily defined or constant impedance … Read more
1. Soldering of PoP 1.2 Process Methods The production mainly adopts the on-board stacking process, which has two methods: 1) Solder paste method; 2) Solder paste method. The core of the process: The process of applying flux or solder paste. 1.3 Common Soldering Defects 1) Open solder/ball pit 1) Bridging 1.4 Mechanism and Causes of … Read more
1. Overview In the assembly and soldering of electronic products, the phenomenon of cold solder joints has always been one of the most prominent issues troubling the reliability of solder joints, especially in high-density assemblies and lead-free soldering. Historically, there have been numerous cases where electronic products (including civilian and military) have failed due to … Read more
Follow 👆 Modern Electronic Assembly Technology Communication Platform👆 Select “Pinned/Starred” Let’s learn together and make progress together! Previous Reviews Collection of Assembly Process Documents: ↓ ↓ ↓ Essentials | Selected Assembly Process Document Collection (1): Save it and read it slowly! Essentials | Selected Assembly Process Document Collection (2): Save it and read it slowly! … Read more
The Definition of SiP System in Package (SiP) refers to the advanced technology of assembling and integrating multiple IC chips and different types of components on a single package substrate to form a complex electronic information system with specific functionalities. Constituent Elements – Package Carrier: Includes PCB, LTCC, Silicon Submount, etc. – Assembly Process: Traditional … Read more
