3D Packaging

3D Packaging Ignites IC Design Revolution, Semiconductor Industry Enters the Era of Three-Dimensional Integration

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3D Packaging Ignites IC Design Revolution, Semiconductor Industry Enters the Era of Three-Dimensional Integration

In the past decade, Moore’s Law has gradually approached its physical limits, while the explosive growth of AI, large model training, and high-performance computing has posed unprecedented challenges to chip performance and energy efficiency. To break through these bottlenecks, the semiconductor industry is undergoing a “three-dimensional revolution” centered on 3D packaging and next-generation IC design. … Read more

How Are Aluminum Cans Manufactured?

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How Are Aluminum Cans Manufactured?

In 1959, Ernie C. Fraze of DRT Company in Dayton, Ohio, invented the pull-tab can, which uses the material of the can lid itself to form a rivet, covered with a pull tab and then riveted tightly, along with corresponding notches to create a complete can lid. This brilliant invention marked a historic breakthrough after … Read more

Comprehensive Guide to Component PCB Packaging

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Comprehensive Guide to Component PCB Packaging

The construction of component packaging is an important part of PCB design. A small mistake can lead to the entire board failing to work and serious delays in the project.Most CAD tools come with a built-in library for standard component packaging, which can also be obtained from the manufacturer’s design documents and reference design sources. … Read more

Explaining The Packaging And Testing Process Of IC Chips

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Explaining The Packaging And Testing Process Of IC Chips

Source: Sensor Technology Source: Reliability Technology Exchange IC Package (the form of IC encapsulation) refers to the different shapes of the encapsulation formed by the chip (Die), various types of frameworks (L/F), and encapsulation materials (EMC). There are many types of IC Packages, which can be classified according to the following standards: Classified by encapsulation … Read more

Understanding the Measurement ‘C’ Mark on Food Packaging

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Understanding the Measurement 'C' Mark on Food Packaging

Requirements for Companies Using the ‘C’ Mark ✕ ✕ In the “Evaluation Criteria for the Measurement Assurance Capability of Quantitative Packaging Product Manufacturing Enterprises”, there are a series of requirements for using the ‘C’ mark, including: ✕ ✕ Measurement Limits Weight: 5g-25kg Volume: 5mL-25L Length: No limit Product Requirements 01 Net Content Marking Companies must … Read more

Chip Yield Rate Halved! 3D Packaging Triggers the Most Severe Technological Crisis in Two Decades

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Chip Yield Rate Halved! 3D Packaging Triggers the Most Severe Technological Crisis in Two Decades

Have you ever touched a freshly baked smartphone chip? That silicon wafer the size of a fingernail is now a hot potato. According to Siemens EDA’s latest data, the global chip yield rate has halved for the first time—plummeting from 24% two years ago to just 14% now, more shocking than your child’s declining monthly … Read more

In-Depth Analysis of the Current State of China’s Chip Packaging Industry (Including Potential Companies)

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In-Depth Analysis of the Current State of China's Chip Packaging Industry (Including Potential Companies)

Continuing from the previous discussion, we previously conducted an in-depth analysis of the upstream materials and chip design industry in China, recommending companies with potential for the future. In this issue, we will discuss the current state of China’s chip packaging industry. The Chinese chip packaging industry is currently at a bottleneck in development. Some … Read more

Wafer Processing Manufacturer Shares: Detailed Explanation of 2.5D/3D Packaging PPT

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Wafer Processing Manufacturer Shares: Detailed Explanation of 2.5D/3D Packaging PPT

Company Overview: Suzhou Senhui Semiconductor, supported by a strong research and technology team, focuses on providing complete process solutions and wafer processing services for global compound semiconductor customers. The team members have been deeply involved in the semiconductor industry for many years, possessing decades of rich experience in photolithography, thin film processes, epitaxy, bonding processes, … Read more

Bridging Chips and Circuit Boards – Packaging

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Bridging Chips and Circuit Boards - Packaging

The development of packaging has evolved from the early DIP to the current 3D ICs [1][2], with a variety of packaging types emerging. Just the QF series has spawned a long list of types such as QFN (no leads), QFP (with leads)… There are many choices in terms of product applications [3], and each type … Read more

How to Install, Compress, and Extract Software Packages on Linux

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How to Install, Compress, and Extract Software Packages on Linux

For those who are new to Linux, the variety of file names associated with Linux can be quite confusing. Take compressed files as an example; we know that the most common compressed files in Windows are just two types: .zip and .rar. However, Linux is different. It has many types of compressed file names such … Read more