A good circuit board not only needs to achieve the functionality of the circuit design but also must consider electrical characteristics such as EMI, EMC, ESD (Electrostatic Discharge), and signal integrity. Additionally, mechanical structure and heat dissipation issues for high-power chips must be taken into account. On this basis, the aesthetic aspect of the circuit … Read more
The widespread application of edge AI models is driving chip manufacturers to gradually adopt heterogeneous computing architectures, combining general-purpose processors with semi-custom AI accelerators to meet the demands of specific tasks. In an era where artificial intelligence and edge computing are increasingly integrated, chip manufacturers are facing new challenges, including how to efficiently and low-power … Read more
Click the title below “Guo Xin Nan Fang” for quick follow-up Source: TechSugar The rise of artificial intelligence brings a series of brand new challenges, along with dazzling innovative choices and necessary trade-offs. As AI is increasingly applied in edge devices, coupled with the growing demand for new functionalities, chip manufacturers are forced to rethink … Read more
【Research Background】 With the continuous growth of societal demand for high-performance electronics and communication technologies, coupled with the ongoing reduction in the size of electronic components, the power density of these components has been steadily increasing. This has raised higher requirements for the thermal management strategies of electronic components. Passive thermal management technologies have attracted … Read more
The launch of powerful, compact single-board computers has driven the design of new products, and its utility is particularly evident in applications that optimize cost and efficiency through miniaturization. Additionally, visual systems can leverage fully-featured board-level machine vision cameras to further reduce the overall size of products and achieve operational flexibility, while also supporting custom … Read more
I got a car board from a friend, and the main appearance is as follows. Car controllers usually use metal housings to shield strong interference, allowing the system to operate more stably. Today, we will mainly dissect this board to see what functional parts it has. Opening the lower part of the housing, the back … Read more
Texas Instruments (TI) today launched the industry’s smallest 36V, 4A power module using Quad Flat No-lead (QFN) packaging. The TPSM53604 DC/DC buck module’s 5mm x 5.5mm footprint enables engineers to reduce power size by 30%, while cutting power loss to 50% of other similar modules. The new power module features a thermal pad to optimize … Read more