Thermal Management

Efficient Power Supply for FPGA Using Integrated DC/DC Regulators

by
Efficient Power Supply for FPGA Using Integrated DC/DC Regulators

Abstract / This article reviews the power supply requirements for FPGAs, emphasizing voltage accuracy, transient response, and voltage sequencing, and details various challenges related to thermal management through operational examples. It then introduces integrated DC/DC regulators from Analog Devices and evaluation boards and integrated recommendations that can accelerate the design process. These regulators are suitable … Read more

Revolution in Chip Cooling: From Micro-Jets to Two-Phase Liquid Cooling

by
Revolution in Chip Cooling: From Micro-Jets to Two-Phase Liquid Cooling

In the rapidly developing field of liquid cooling technology, the “cold plate” is no longer the only solution. When faced with AI chips and power modules that can generate hundreds of watts, or even kilowatts of heat density, traditional cooling solutions are becoming inadequate. The challenge of how to “precisely extract” heat from the core … Read more

Guide to Enhanced Heat Dissipation Printed Circuit Boards

by
Guide to Enhanced Heat Dissipation Printed Circuit Boards

The structure, manufacturing methods, and applications of printed circuit boards (PCBs) with electronic components. The core of this patent lies in improving heat dissipation efficiency by directly connecting heat dissipation elements to the wiring layer of the PCB, allowing for embedding in high-heat components such as power amplifiers. Key Concepts and Components Printed Circuit Board … Read more

Addressing Power Challenges in AI Data Centers

by
Addressing Power Challenges in AI Data Centers

As artificial intelligence (AI) continues to play a central role in data center operations, the demand for efficient and high-performance power solutions is becoming increasingly important.AI workloads require substantial computational resources, leading to increased power consumption and heat generation.These challenges necessitate innovative approaches in power data conversion and distribution, focusing on optimizing electronic components such … Read more

The Significance of 30℃ for Liquid Cooling and Chip Thermal Management in Data Centers

by
The Significance of 30℃ for Liquid Cooling and Chip Thermal Management in Data Centers

Source | OCP Official Website [Insights on Thermal Management] Recently, the OCP official website released a white paper titled “30℃ Coolant– A Durable Roadmap for The Future” authored by a team from META, Vertiv, Samsung, AMD, Intel, and Nvidia, leading participants in the global data center industry. The article focuses on the temperature standards for … Read more

Printed Circuit Board (PCB) Design

by
Printed Circuit Board (PCB) Design

Printed Circuit Board PCB Design Printed Circuit Board (PCB) design is one of the core skills in electronic engineering, essential for both simple electronic projects and complex industrial products. 1.PCB Design Basic Process 1. Schematic Design Use EDA tools (such as Altium Designer, KiCad, Eagle) to draw the circuit schematic and define the connections between … Read more

Advanced PCB Design Techniques

by
Advanced PCB Design Techniques

Printed Circuit Board Advanced PCB Design Advanced design of Printed Circuit Boards (PCBs) requires a combination of engineering practice, signal integrity analysis, electromagnetic compatibility (EMC) design, and manufacturing processes. The following are the core points and practical tips for advanced design to help you enhance the professionalism and reliability of PCB design. 1.High-Speed Signal and … Read more

High Thermal Conductivity Insulation Sheets for Electric Vehicle MCU Motor Controllers

by
High Thermal Conductivity Insulation Sheets for Electric Vehicle MCU Motor Controllers

The three main components of new energy vehicles are the battery (Battery), motor (Motor), and electrical control system (Electrical Control System).1. Battery (Battery): The battery is the energy source for new energy vehicles, responsible for storing and releasing electrical energy. 2. Motor (Motor): The motor is the device that converts the electrical energy provided by … Read more

Considerations for BGA Thermal Management Solutions in SMT PCB Assembly Design

by
Considerations for BGA Thermal Management Solutions in SMT PCB Assembly Design

The main purpose of thermal management is to ensure that all electronic components, especially BGA, are maintained within their functional and maximum allowable limits. The functional temperature limit defines the range of environmental temperatures or component package temperatures that allow electronic circuits to operate normally. It is essential to understand the cooling technologies that the … Read more

BYD Semiconductor Obtains Patent for Heat Exchange Structure, Enhancing Heat Exchange Efficiency

by
BYD Semiconductor Obtains Patent for Heat Exchange Structure, Enhancing Heat Exchange Efficiency

The “temperature war” in the new energy vehicle sector is quietly escalating. While consumers worry about range anxiety, engineers are brainstorming another battle—how to keep batteries, motors, and power modules operating within optimal temperature ranges. Recently, a new patent from BYD Semiconductor has provided an elegant solution for this battle. From “Linear Thinking” to “Three-Dimensional … Read more