Chip Assembly Process

Chip Assembly Process

Source: Semiconductor Engineer Original Author: Chip Failure Analysis This article introduces the chip assembly process. The chip assembly process is a crucial part of electronic product manufacturing. Chip assembly involves installing chips onto circuit boards, including steps like placement, soldering, and testing. Below, we will detail the specific process of chip assembly. 1. Placement: First, … Read more

Differences Between PCB and PCBA

Differences Between PCB and PCBA

Click Blue Text Follow us~ After entering the PCB industry, we often encounter two very similar concepts: PCB and PCBA. So, what are the differences between PCB and PCBA? Let’s learn together with Shenlian Circuit Board Factory! 1. About PCB PCB stands for Printed Circuit Board, which is an important electronic component in the electronics … Read more

What Are The Layers In A PCB Circuit? What Are Their Functions?

What Are The Layers In A PCB Circuit? What Are Their Functions?

In the field of electronic engineering, printed circuit boards (PCBs) are indispensable components that carry the connections and communication between electronic components. A PCB is not a single-layer structure; it is composed of multiple layers, each with its specific functions and roles. Let’s discuss them below. 1. Mechanical Layer Definition: The mechanical layer represents the … Read more

Five Key Requirements for PCB Processing

Five Key Requirements for PCB Processing

1. PCB Size 【Background Information】The size of the PCB is limited by the capabilities of the electronic processing production line equipment. Therefore, suitable PCB sizes should be considered during the product system design. (1) The maximum PCB size that SMT equipment can mount is based on the standard size of PCB materials, most of which … Read more

Five Major Requirements for PCB Processing

01 PCB Size [Background Explanation] The size of the PCB is limited by the capabilities of the electronic processing production line equipment. Therefore, suitable PCB sizes should be considered during product system design. (1) The maximum PCB size that SMT equipment can mount originates from the standard size of PCB materials, most of which are … Read more

PCBA Manufacturing Process Specification: SPI Solder Paste Inspection

PCBA Manufacturing Process Specification: SPI Solder Paste Inspection

For more exciting content, please click👆SMT Home👇Follow me,Set as ★Star Mark★ Cited Standards No. Document No. Document Title 1 IPC-7525 Stencil Design Guidelines 2 IPC-7527 Solder Paste Printing Requirements 3 IPC/EIA J-STD-004 Flux Requirements 4 IPC/EIA J-STD-005 Solder Paste Requirements 5 IPC-A-600 Acceptability of Printed Boards 6 IPC-A-610 Acceptability of Electronic Components 7 IPC-7711/21 Rework … Read more

SPI Parameter Setting Standards and SMT Solder Paste Usage Algorithm

SPI Parameter Setting Standards and SMT Solder Paste Usage Algorithm

For more exciting content, please click👇SMT Home👇Follow me,set as ★Star★ Parameter setting reference: “IPC-7527 Solder Paste Printing Requirements” Advertising space recruitment: Recruitment phone:150 9990 5300 Recruitment WeChat: SMTDFM Disseminate true knowledge, empower intelligent manufacturing; If it helps, I am honored! END ▼ Click the card below to discover more wonderful articles You“Are you watching”?