The failure caused by capacitor damage is the highest in electronic devices, especially with the failure of electrolytic capacitors being the most common. Capacitor damage manifests as: reduced capacity, complete loss of capacity, leakage, and short circuit.Capacitors play various roles in circuits, and the faults they cause are also characterized differently: in industrial control circuit … Read more
—————————————————————————————————————————————————————-The main text begins here—————————————————————————————————————————— SPI is the abbreviation for Solder Paste Inspection. The widespread use of SPI in SMT (Surface Mount Technology) manufacturing is largely due to the development of the current electronics manufacturing industry. Those working in the SMT manufacturing industry know that many defects in SMT occur due to solder paste printing … Read more
Welcome FPGA engineers to join the official WeChat technical group. Clickthe blue textto follow us at FPGA Home – the largest and best FPGA pure engineer community in China. Introduction: Transmission lines define and control characteristic impedance along their length. However, the three-dimensional structure at their interfaces does not have easily defined or constant impedance … Read more
Solder Mask: solder mask refers to the part of the board that is to be coated with green oil; because it is a negative output, the part that actually has the solder mask does not get green oil but is instead coated with tin, appearing silver-white!Paste Mask: paste mask is used during machine placement and … Read more
Solder Mask Layer The solder mask refers to the areas on the board where green oil is applied; since it is a negative output, the areas with solder mask actually do not have green oil but are instead coated with tin, appearing silver-white! Paste Mask Layer The paste mask is used during machine placement and … Read more
Definition of PCB Layers: Solder mask layer: solder mask, refers to the part of the board where green oil is applied; since it is a negative output, the part with solder mask actually does not have green oil but is plated with tin, appearing silver-white! Paste mask layer: paste mask, is used during machine placement, … Read more
To properly place SMT components, the PCB must remain completely flat. For accurate placement, the pick-and-place machine must release the SMT components at the same height above the circuit board for all components. If the PCB is warped, meaning it is not flat, the machine cannot maintain a constant height when placing components on the … Read more
For employees in the electronics manufacturing industry, understanding the entire production process of PCBA in an electronic factory is not easy. Therefore, I have specially organized the main workstations on the DIP plug-in and SMT chip production lines into a flowchart, hoping everyone can clearly remember the different segments of the production line. Analysis of … Read more
The PCBA processing costs consist of the following parts: PCB Board Cost (If you provide it yourself, there is no charge) Component Procurement Cost (If you provide this as well, there is also no charge) SMT Processing Cost (SMD Mounting + DIP Soldering) PCBA Testing and Assembly Cost 1. PCB Board Cost If you want … Read more
1. Soldering of PoP 1.2 Process Methods The production mainly adopts the on-board stacking process, which has two methods: 1) Solder paste method; 2) Solder paste method. The core of the process: The process of applying flux or solder paste. 1.3 Common Soldering Defects 1) Open solder/ball pit 1) Bridging 1.4 Mechanism and Causes of … Read more