NXP’s S32N Series Provides Strong Computing and Security Support for SDV

NXP's S32N Series Provides Strong Computing and Security Support for SDV

The global MCU market is dominated by five manufacturers: Infineon, NXP, Renesas Electronics, STMicroelectronics, and Microchip Technology, with Infineon and Renesas Electronics performing particularly well in 2024. NXP maintains a leading position in automotive electronics and security chips, while Microchip holds a significant position in the 8-bit microcontroller market. The company’s product line covers a … Read more

Canaan Technology’s Multiple Chip Customization Projects Enter Design Phase, Expected to Tape Out This Year

Canaan Technology's Multiple Chip Customization Projects Enter Design Phase, Expected to Tape Out This Year

According to news from the semiconductor industry, on June 10, Canaan Technology stated during an institutional survey that multiple chip customization projects have entered the design phase in the first quarter of 2025 and are expected to tape out within this year. The company provides design services for an MRAM control chip project, which is … Read more

PCBA Aging Failure: Insights from the Drip Test (Video Included)

PCBA Aging Failure: Insights from the Drip Test (Video Included)

Today, I am sharing a small experiment I conducted many years ago, paying tribute to Mr. Jin and all the comrades from the PCBA soldering improvement team!Background IntroductionDuring the transition from leaded to lead-free soldering, various failures such as remote control malfunction and failure to power on occurred in TV products during the damp heat … Read more

Open Source 100,000 RPM Ultra-Compact PCBA Brushless Motor Drive Solution with Integrated Pre-driver Op-Amp LDO and Ultra-Simplified BOM!

Open Source 100,000 RPM Ultra-Compact PCBA Brushless Motor Drive Solution with Integrated Pre-driver Op-Amp LDO and Ultra-Simplified BOM!

Imagine if we were tasked with designing a <span>24V powered 100,000 RPM brushless sensorless</span> small fan drive project, how should we design it? Today, let’s get straight to the <span>hardware</span> design selection. <span>In traditional</span> solutions, we would look for a <span>general-purpose</span> MCU with advanced timers, AD acquisition, DMA, etc. The rest would be conventional design, … Read more

The Eight Major Production Process Systems of PCBA

The Eight Major Production Process Systems of PCBA

The eight major process systems of PCBA (Printed Circuit Board Assembly) cover the entire process from component placement to finished product testing and packaging, detailed as follows: 1. SMT (Surface Mount Technology) Process Process: Solder paste printing → Component placement → Reflow soldering Function: Precisely place surface mount devices (SMD) onto PCB pads and form … Read more

Practical Guide: Key Considerations for DPA Slicing of Flexible Printed Circuit Boards (FPCA)

Practical Guide: Key Considerations for DPA Slicing of Flexible Printed Circuit Boards (FPCA)

Warm reminder: The article is about 3400 words long and will take about 10 minutes to read. You will definitely gain insights after reading it. If you want to learn more professional knowledge and industry information, you can join my knowledge community and grow continuously with me.When it comes to flexible printed circuit boards (FPCA), … Read more

How Hardware Engineers Maintain Signal Integrity, Power Integrity, and Set Up EMC Protection for PCB Circuit Boards

How Hardware Engineers Maintain Signal Integrity, Power Integrity, and Set Up EMC Protection for PCB Circuit Boards

The following is a comprehensive technical solution for hardware engineers to achieve Signal Integrity (SI), Power Integrity (PI), and EMC protection in PCB design, presented in a combination of tables and text: 1. Signal Integrity (SI) Design Specifications 1. Layout and Routing Optimization Impedance Matching: Ensure that the characteristic impedance of transmission lines (such as … Read more

Advanced Ceramics Q&A: What is the Difference Between Through Holes and Filled Vias in Ceramic Circuit Boards? What is a Silicon Carbide Mirror Blank?

Advanced Ceramics Q&A: What is the Difference Between Through Holes and Filled Vias in Ceramic Circuit Boards? What is a Silicon Carbide Mirror Blank?

The following questions are sourced from various inquisitive learners on Zhihu. As an advanced ceramics B2B platform serving the industry, CERADIR Advanced Ceramics Online strives to answer users’ queries. In the future, our editor will share related Q&A here weekly, and we welcome industry friends to ask us questions on Zhihu. If there are any … Read more

Guide to Advanced Carrier-Supported Copper Foil and PCB Manufacturing

Guide to Advanced Carrier-Supported Copper Foil and PCB Manufacturing

Research Guide on Carrier-Supported Copper Foil, Coreless Support, and PCB Manufacturing Methods 1. Overview and Core Concepts This research guide aims to provide an in-depth understanding of carrier-supported copper foil and its applications in coreless support and printed circuit board (PCB) manufacturing. The focus is on a novel design of carrier-supported copper foil that addresses … Read more

Guide to Automated Cleaning Equipment for Integrated Circuit Boards

Guide to Automated Cleaning Equipment for Integrated Circuit Boards

Guide to High-Performance Integrated Circuit Board Effective Dust Removal and Cleaning Equipment Overview This guide aims to help you gain a deep understanding of the patent literature on “a high-performance integrated circuit board effective dust removal and cleaning equipment.” This device is designed to address the time-consuming and inefficient issues of traditional circuit board cleaning … Read more