Tian Neng Jian Controller K300 Technical Specification

Tian Neng Jian Controller K300 Technical Specification

Tian Neng Jian Controller K300 Technical Specification Parameter Information: Brand Shenzhen Tian Neng Jian Electric Technology Co., Ltd. Model K300 Parameters Bus Current 100A Phase Current 300A Connection Method Built-in Bluetooth Mini Program Smart Debugging Place of Origin Shenzhen, China Manufacturer Shenzhen Tian Neng Jian Electric Technology Co., Ltd. Color Transparent Exploration Version Ultimate Matte … Read more

Signal Generator Based on 51 Microcontroller

Signal Generator Based on 51 Microcontroller

Long press the QR code below to enter the public account Abstract The signal generator is a commonly used signal source, widely applied in electronic circuits, automatic control systems, and teaching experiments.This design uses the AT89C51 microcontroller as the control core, with external digital/analog conversion circuits (DAC0832), operational amplifier circuits (LM324), buttons, and a 1602 … Read more

Differences Between 51 Microcontroller and STM32 Microcontroller

Differences Between 51 Microcontroller and STM32 Microcontroller

In the vast realm of embedded system development, microcontrollers shine like stars, illuminating the path for countless innovative applications. From smart appliances to industrial automation, from handheld devices to aerospace, microcontrollers are ubiquitous; they serve as the core brain of embedded systems, responsible for processing various complex data and control tasks. However, faced with a … Read more

What is an SoC Chip?

What is an SoC Chip?

A System on Chip (SoC) is the culmination of modern microelectronics technology, redefining the construction of electronic systems by integrating multidimensional functional units onto a single chip. Unlike traditional discrete architectures, SoCs integrate core components such as the central processing unit, graphics processing unit, communication modules, and storage units into a single silicon substrate, creating … Read more

Analysis of the 140W Multi-Port Power Bank Reference Design Powered by the Next-Generation Flagship SoC CPW6430 from Chipsea Technology

Analysis of the 140W Multi-Port Power Bank Reference Design Powered by the Next-Generation Flagship SoC CPW6430 from Chipsea Technology

Introduction Chipsea Technology has launched the next-generation versatile multi-fast charging protocol Buck-Boost SoC CPW6430, which is an integrated “three-in-one” chip that includes a full protocol stack such as PD3.2 and UFCS, a synchronous bidirectional buck-boost controller, and a high-performance MCU. This chip aims to address three core pain points in the current fast charging market: … Read more

Research Progress on Visible Light Excited Photochromic Room Temperature Phosphorescent Materials by Academician Huang Wei’s Team at Northwestern Polytechnical University

Research Progress on Visible Light Excited Photochromic Room Temperature Phosphorescent Materials by Academician Huang Wei's Team at Northwestern Polytechnical University

Light-responsive organic functional materials, including photochromic materials and room temperature phosphorescent materials, have attracted significant attention in recent years due to their excellent performance. However, most reported light-responsive organic materials have single functions and typically require ultraviolet light activation, which significantly limits their applications in fields such as multi-channel information storage. Therefore, developing multifunctional organic … Read more

Xiaomi’s Self-Developed Smartphone SoC ‘Xuanjie O1’ Officially Announced, Possibly Based on 3nm Process!

Xiaomi's Self-Developed Smartphone SoC 'Xuanjie O1' Officially Announced, Possibly Based on 3nm Process!

The long-rumored new self-developed smartphone SoC from Xiaomi has finally been officially announced! On the evening of May 15, Xiaomi CEO Lei Jun announced via Weibo that Xiaomi’s self-developed smartphone SoC chip is named “Xuanjie O1” and will be officially released in late May this year. However, Lei Jun did not disclose more details about … Read more

AI Glasses Lead the Way for New Multimodal Applications with High-Performance and Low-Power Edge SoC Chips

AI Glasses Lead the Way for New Multimodal Applications with High-Performance and Low-Power Edge SoC Chips

AI glasses are paving the way for new multimodal applications, utilizing edge SoC chips that combine high performance with low power consumption. This advancement is crucial for the development of smart wearable devices that require efficient processing capabilities while maintaining battery life.

In-Depth Analysis of Chip I/O Units in SoC Chip Design

In-Depth Analysis of Chip I/O Units in SoC Chip Design

1. Basic Structure of I/O Units The I/O PAD is a critical part of the chip that connects to external circuits, typically consisting of bonding pads, circuits, power lines, and ground lines. The bonding pad (PAD) is used to connect the chip to the package substrate via gold wires, usually shaped as rectangles measuring several … Read more

Xiaomi’s Self-Developed Mobile SoC Chip Emerges: Lei Jun Summarizes the Decade-Long Journey

Xiaomi's Self-Developed Mobile SoC Chip Emerges: Lei Jun Summarizes the Decade-Long Journey

After a decade on the “chip-making” path, Xiaomi has launched its second self-developed mobile SoC chip, with Lei Jun summarizing the journey of Xiaomi’s chip development as “a decade of ice-drinking, yet the passion remains hot.” From the evening of May 15 to May 16, Lei Jun posted three Weibo updates announcing Xiaomi’s self-developed mobile … Read more