Introduction: Previously, I introduced the manufacturing and packaging of chips. In this article, we will look at chip design.█ Design Concepts of ChipsAs we all know, chips have extremely complex structures.Taking NVIDIA’s B200 chip as an example, it contains 208 billion transistors in an area the size of a palm. The layout inside is akin … Read more
1. Core Products/Core Technologies 1. STMicroelectronics’ New Generation Active Fuse Driver – L9965P To briefly introduce the background of fuse products: traditional fuses cannot achieve precise control through software and cannot accurately determine the timing of fuse operation based on the type of fault. To address these challenges, fuse manufacturers have developed intelligent controllable Pyro-Fuse … Read more
Chip brain, allowing your child to be born as a sage!Today, at a robotics exhibition, I encountered something quite interesting. It wasn’t particularly rare, just a mechanical hand that could mimic human hand movements based on an external camera. However, there was something intriguing written on the display board behind it—controlling hand movements with thought, … Read more
Source:Learning About Things Original Author:Long Road Ahead This article mainly discusses why epitaxial growth technology is the core process of semiconductor manufacturing. Epitaxial Growth Technology: The Core Process of Semiconductor Manufacturing As the feature sizes of semiconductor devices continue to shrink, the demand for high-quality thin film materials becomes increasingly urgent. Epitaxial technology, as a … Read more
Click the blue text Follow us In November 2018, the Shanghai Stock Exchange established the Science and Technology Innovation Board (STAR Market); in July 2019, the STAR Market officially opened, with the first 25 companies ringing the bell for their IPOs. At the inception of the STAR Market, it coincided with a time of geopolitical … Read more
Follow our public account, click the top right corner of the public account homepage ” · · · “, set a star mark, and stay updated on the latest news in automotive semiconductors. There are many packaging forms for semiconductor devices, which can be classified into three categories based on their shape, size, and structure: … Read more
Traditional thermal sink materials (such as W/Cu, Mo/Cu, and SiC/Al) generally have thermal conductivities below 200 W/(m·K), making it difficult to meet the heat dissipation requirements of high-power devices (such as GaN and SiC). Carbon materials represented by diamond and graphene, with their ultra-high thermal conductivity (diamond reaches 2200 W/(m·K)) and low thermal expansion coefficient … Read more
Introduction: The quality design and control during the semiconductor product development phase is crucial for ensuring product success, high reliability, and cost-effectiveness. For large semiconductor companies (such as Toshiba, ON, Samsung, Renesas, Vishay, ADI, etc.), this is not merely about simple quality inspection, but rather a systematic engineering process that spans the entire product lifecycle. … Read more
On June 11, 2025, Huawei made a stunning debut with the Pura 80 series smartphones, quickly becoming the focus of the tech world. From design to performance, this series showcases Huawei’s innovative strength, with many highlights drawing attention. Behind this series of outstanding performances lies an ‘unsung hero’—the high-frequency probes, which play a crucial role … Read more
Tian Neng Jian Controller K300 Technical Specification Parameter Information: Brand Shenzhen Tian Neng Jian Electric Technology Co., Ltd. Model K300 Parameters Bus Current 100A Phase Current 300A Connection Method Built-in Bluetooth Mini Program Smart Debugging Place of Origin Shenzhen, China Manufacturer Shenzhen Tian Neng Jian Electric Technology Co., Ltd. Color Transparent Exploration Version Ultimate Matte … Read more