manufacturing process

Differences Between Packaging Substrates and PCBs

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Differences Between Packaging Substrates and PCBs

Although both packaging substrates (IC packaging boards) and printed circuit boards (PCBs) serve connection and support functions in electronic devices, there are essential differences between the two in terms of definition, functional positioning, technical parameters, material processes, and application scenarios. 1. Core Definitions and Functional Positioning Differences 1.Packaging Substrate lDefinition: A special substrate that directly … Read more

Practical Guide: Key Considerations for DPA Slicing of Flexible Printed Circuit Boards (FPCA)

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Practical Guide: Key Considerations for DPA Slicing of Flexible Printed Circuit Boards (FPCA)

Warm reminder: The article is about 3400 words long and will take about 10 minutes to read. You will definitely gain insights after reading it. If you want to learn more professional knowledge and industry information, you can join my knowledge community and grow continuously with me.When it comes to flexible printed circuit boards (FPCA), … Read more

Knowledge of FPC Flexible Printed Circuit Board Processing Technology

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Knowledge of FPC Flexible Printed Circuit Board Processing Technology

1. Overview of FPC Flexible Printed Circuit Boards Printed circuit boards are fundamental products in the electronics industry, widely used in communication devices, computers, automotive electronics, industrial equipment, and various household appliances. Their main function is to support circuit components and interconnect circuit elements.FPC flexible printed circuit boards are a major category of printed circuit … Read more

Dimensional Accuracy of Dry Pressed Ceramic Sensors

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Dimensional Accuracy of Dry Pressed Ceramic Sensors

Ceramic sensors have very strict requirements for dimensional accuracy, which is mainly reflected in two aspects. On one hand, the dimensional accuracy of the sensor directly affects its fit during the assembly process and its reliability during use. If there are significant deviations in the sensor’s dimensions, it may lead to difficulties during assembly or … Read more

Guide to Learning Circuit Board Technology

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Guide to Learning Circuit Board Technology

Guide to Learning Circuit Board Technology Overview This learning guide aims to help you review and consolidate your understanding of the circuit board technologies introduced in the source material. The source material discusses various types of Printed Circuit Boards (PCBs), their applications, key steps in the manufacturing process, and connection methods. It also covers different … Read more

Guide to Flexible Circuit Boards and COF Module Technology

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Guide to Flexible Circuit Boards and COF Module Technology

Guide to the Structure and Manufacturing Methods of Flexible Circuit Boards Abstract This guide aims to help you review and consolidate your understanding of Flexible Printed Circuit Boards (FPCB), Chip on Film (COF) modules, and their manufacturing methods. The main content covers the components of flexible circuit boards, the characteristics of bent and non-bent areas, … Read more

Analysis and Improvement of PCB Drilling Quality Defects

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Analysis and Improvement of PCB Drilling Quality Defects

1. Abstract The drilling process is one of the most important components of the entire printed circuit board (PCB). Parameters such as hole position accuracy, hole diameter tolerance, and hole wall roughness directly affect the quality of the PCB and the reliability of product performance. Therefore, strict control of relevant quality items is required during … Read more

Guide to Multilayer Circuit Board Manufacturing

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Guide to Multilayer Circuit Board Manufacturing

Guide to Multilayer Circuit Board Manufacturing Technology Learning Objectives This guide aims to help you review and understand the methods of multilayer circuit board manufacturing and the resulting circuit boards. It focuses on the following aspects: Core Technology: Understand the core innovations of this patent, which is a method that simplifies the multilayer circuit board … Read more

Method for Manufacturing Multilayer Circuit Boards and Multilayer Circuit Boards

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Method for Manufacturing Multilayer Circuit Boards and Multilayer Circuit Boards

2. Technical Field The invention relates to a method for manufacturing multilayer circuit boards and the multilayer circuit boards obtained by this method. In particular, as consumer electronic products increasingly develop towards being thinner, smaller, and smarter, the requirements for circuit boards (FPC) as important components are becoming higher. In existing technologies, the manufacturing of … Read more

Optimization Solutions for Irregular BGA Solder Points on PCB Boards

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Optimization Solutions for Irregular BGA Solder Points on PCB Boards

The design of BGA (Ball Grid Array) on PCB boards is very common in the industry, and the issue of irregular BGA sizes can severely affect the soldering quality and electrical performance of PCBs. To effectively improve this issue, it is necessary to address it from the aspects of design and manufacturing processes.1. Package Design1. … Read more