Analysis of the Impact of Back Power Distribution Network (BSPDN) on Power/Performance/Area/Temperature (PPAT)
Literature from IMEC, published in 2022, focuses on the impact of BSPDN on PPAT.The front end (FEOL) is an active driver of chip power/performance/area (PPA). As scaling approaches the physical limits of semiconductor devices, the back end (BEOL)/middle end (MEOL)/packaging becomes increasingly important for PPA improvements in chips/systems. At 2nm and below, BSPDN back interconnects … Read more