PCB: Resonance of Cycles and Growth, Industry Upgrade in the AI Era

PCB: Resonance of Cycles and Growth, Industry Upgrade in the AI Era

Copper-clad laminates: Market prices continue to rise, with a clear trend towards high-speed and high-frequency applications. From a cyclical perspective, the price of copper-clad laminates shows a positive correlation with the price of bulk copper. After an 8% increase in the average spot price of LME copper in 2024 compared to 2023, the average spot … Read more

Introduction to Key Points of SPI Hardware Design

Introduction to Key Points of SPI Hardware Design

Today, we will introduce the widely used SPI communication between PCB boards, striving to minimize the introduction of overly textual definitions and instead use straightforward language to explain. Definition: SPI (Serial Peripheral Interface) is a type of serial synchronous communication, which is mostly full-duplex (but it can also be half-duplex), primarily used in chips such … Read more

Focus on the ASIC Optical Module and PCB Industry Chain!

Focus on the ASIC Optical Module and PCB Industry Chain!

Dedicated to financial professionalsas a research and investment information platform Expectation difference is productivity。 —— Jingbei Yueguang 🔥 AI Market Weekly Review: Oracle (weekly increase of 24%/same below), NVIDIA/Microsoft/Google/META/Amazon all reached new highs after the April tariff war low; in the optical module sector, Tianfu Communication (+14%) and Zhongji Xuchuang (+13%) continue to confirm our … Read more

Why PCB Prices Are Rising? Focus on the ASIC Supply Chain!

Why PCB Prices Are Rising? Focus on the ASIC Supply Chain!

On June 17, Nomura Securities released a latest research report stating that Meta is expected to launch its next-generation AI ASIC chip MTIAT-V1 as early as the fourth quarter of 2025. This chip is designed by Broadcom and utilizes high-spec 36-layer PCBs and hybrid cooling technology, with specifications exceeding those of NVIDIA’s next-generation AI chip … Read more

Guide to Enhanced Heat Dissipation Printed Circuit Boards

Guide to Enhanced Heat Dissipation Printed Circuit Boards

The structure, manufacturing methods, and applications of printed circuit boards (PCBs) with electronic components. The core of this patent lies in improving heat dissipation efficiency by directly connecting heat dissipation elements to the wiring layer of the PCB, allowing for embedding in high-heat components such as power amplifiers. Key Concepts and Components Printed Circuit Board … Read more

Fundamentals of Printed Circuit Boards (PCBs)

Fundamentals of Printed Circuit Boards (PCBs)

What is a printed circuit board? A printed circuit board is a circuit formed by arranging conductive metal lines on an insulating substrate. In simple electronic projects, reconfigurable circuit boards such as breadboards or universal boards are often used, while printed circuit boards are fixed substrates that have these circuits pre-manufactured. The greatest advantage of … Read more

Differences Between Packaging Substrates and PCBs

Differences Between Packaging Substrates and PCBs

Although both packaging substrates (IC packaging boards) and printed circuit boards (PCBs) serve connection and support functions in electronic devices, there are essential differences between the two in terms of definition, functional positioning, technical parameters, material processes, and application scenarios. 1. Core Definitions and Functional Positioning Differences 1.Packaging Substrate lDefinition: A special substrate that directly … Read more

High Debt in the PCB Industry: Not Borrowing Money Means Waiting for Death

High Debt in the PCB Industry: Not Borrowing Money Means Waiting for Death

The essence of the industry is to burn money for technology; without money, you are out. Equipment is as expensive as a money printing machine, with an investment of over 1 billion for a high-end HDI production line, and even more for lines with more than 18 layers. Huadong Technology’s factory in Thailand invested 1.7 … Read more

Update on PCB Developments

Update on PCB Developments

Summary of developments related to NVIDIA server PCB products:1. H100 Related Information• Order Visibility: Currently, order visibility extends to August, and subsequent production schedules are closely dependent on client demand trends. If client demand remains stable, production schedules after August may maintain the current pace; however, any fluctuations in client demand, whether an increase leading … Read more

PCBA Aging Failure: Insights from the Drip Test (Video Included)

PCBA Aging Failure: Insights from the Drip Test (Video Included)

Today, I am sharing a small experiment I conducted many years ago, paying tribute to Mr. Jin and all the comrades from the PCBA soldering improvement team!Background IntroductionDuring the transition from leaded to lead-free soldering, various failures such as remote control malfunction and failure to power on occurred in TV products during the damp heat … Read more