thermal interface materials

Common Thermal Interface Materials for Circuit Boards and Their Applications

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Common Thermal Interface Materials for Circuit Boards and Their Applications

In the design and application of circuit boards (PCBs ), thermal interface materials (TIMs) are key components for solving heat dissipation issues. They are used to fill the gaps between heat-generating components and heat dissipation parts, reducing thermal resistance and improving heat dissipation efficiency. Below is a detailed introduction to commonly used thermal interface materials … Read more

Considerations for BGA Thermal Management Solutions in SMT PCB Assembly Design

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Considerations for BGA Thermal Management Solutions in SMT PCB Assembly Design

The main purpose of thermal management is to ensure that all electronic components, especially BGA, are maintained within their functional and maximum allowable limits. The functional temperature limit defines the range of environmental temperatures or component package temperatures that allow electronic circuits to operate normally. It is essential to understand the cooling technologies that the … Read more