“Theoretically no problem, but the processing is a complete mess” – this phrase is a nightmare for many optical engineers. Three years ago, a high-end surveillance lens designed by my team fell into this pit: the theoretical MTF value was close to the diffraction limit, yet the yield of the first batch of samples was … Read more
During the PCB design process, before routing, we generally stack the layers of the project we are designing, calculating the impedance based on thickness, substrate, number of layers, and other information. After the calculations, we typically obtain the content shown in the figure below. From the above figure, it can be seen that the single-ended … Read more
Have you ever wondered why a chip the size of a fingernail can sell for more than gold or even diamonds? In the current technological environment, chips are the food of modern industry and the scepter of great power competition. NVIDIA’s graphics cards have skyrocketed in price, and the costs of high-end manufacturing processes are … Read more
In PCB design, removing via annular pads on non-functional connection layers (i.e., no annular design) to enhance routing and signal integrity is a precision technique that requires careful consideration. The table below summarizes its core advantages and disadvantages, helping you quickly establish an understanding. Dimension Advantages of No Annular Design (Benefits) Challenges and Risks of … Read more
From diodes to nanoscale chips, the working principles and precision manufacturing processes of semiconductor devices form the physical foundation of the digital age. Semiconductor devices are the cornerstone of modern electronic technology, essential for everything from smartphones and computers to new energy vehicles and industrial control systems. The core function of these devices lies in … Read more
1. The Core Role of Surface Treatment Processes First, it is important to understand why surface treatment is necessary: Preventing Copper Oxidation: Bare copper is highly susceptible to oxidation in the air, and the resulting copper oxide can severely damage solderability. Providing a Solderable Layer: It provides a good soldering surface for the connection between … Read more
We cordially invite you to participate for free in the first China Aluminum Alloy Application Development Conference. 3D printing technology reference notes that Yang Feng, the director of the Yangwang Research Institute at BYD, introduced the development process of the U9X body 3D printing technology on October 30. He stated that this is a groundbreaking … Read more
3D printed shoes are an emerging footwear technology. In recent years, with the maturation of 3D printing technology and advancements in materials science, their application scope and market acceptance have continuously increased. The related landscape is as follows: Technology Research and Innovation – Printing Process Upgrades: The printing methods have evolved from early single printing … Read more
Challenges and Future Evolution of Optical Module Technology on PCBs As the core interconnection unit of computing infrastructure such as data centers and 5G communications, optical modules have undergone a technological evolution from 100G to 400G, 800G, and even 1.6T, which has imposed comprehensive technical reconstruction requirements on the PCBs (Printed Circuit Boards) that carry … Read more
In modern semiconductor industry, high purity targets play a crucial role as important materials for thin film deposition technology. The quality of the target directly determines the quality of the deposited film, which in turn affects the performance, reliability, and yield of semiconductor devices. This article will delve into the characteristics of high purity targets … Read more