Introduction Etching and thin film deposition are becoming the core areas of market focus. Download for free today: 2025 Semiconductor Industry In-Depth Report Source: Semiconductor Industry Insights Author: Feng Ning Recently, a financial report from Zhongwei Company reflects that the semiconductor equipment market’s focus is expanding beyond photolithography machines to include other core equipment fields … Read more
Most engineers send the PCB files or Gerber files to the manufacturer and then wait for the boards to be returned. However, many hardware development professionals may work for years without the opportunity to visit a PCB manufacturing facility to see the entire production process. Today, I will take you on a tour to see … Read more
After exposure, the PCB board needs to have the Mylar on the dry film stripped before entering the DES process. Of course, PCBs using wet film technology do not have the issue of Mylar and do not require its protection. Stripping Mylar Mylar stripping can be done manually or using automated equipment. Example of Mylar … Read more
On a silicon wafer the size of a fingernail, billions of transistors are precisely arranged, and the accurate coordination of semiconductor process modules brings these microscopic structures to life. Chip manufacturing is one of the most complex manufacturing processes in the world today, requiring the perfect coordination of hundreds of precise steps. From a grain … Read more
Professional Terminology in the PCB Industry (A-C) DDate Code Production DateRefers to the production date of the product, usually expressed in a 4-digit format (YY+WW), presented on the board through etching or printing, and typically displayed alongside the company logo and UL certification for identification or subsequent traceability.DES (Development–Etching–Stripping) is an abbreviation for development-etching-stripping, a … Read more
1 Purpose To inspect the uniformity of the outer layer etching lines 2 Testing Conditions At room temperature 3 Testing Instruments ISO Scope® MP30Copper Thickness Tester 4 Test Preparation Take severalFR—4 copper-clad boards, the surface must be clean and free of contaminants, specifications:1/1OZ,1.2mm~1.5mm, 18″×24″ 5 Testing Steps 5.1Take1PCS test board and pass it through the … Read more
The “opening pad” process for image sensors (especially CMOS image sensors, CIS), officially known as “aluminum pad layer etching” or “passivation layer opening” process, is a critical step in the backend of chip manufacturing. The purpose of this step is to open the insulating layer (passivation layer) on the pads that electrically connect the internal … Read more
Investing without understanding value is merely following the trend and will ultimately lead to confusion! (For knowledge sharing only, not investment advice) What does chip manufacturing rely on? It relies on equipment. Lithography machines are responsible for "drawing", while etching machines are responsible for "carving". Each process determines the performance and yield of the chip. … Read more
Photoresist, also known as photoresist, is a non-conductive photosensitive material that transfers patterns from a photomask onto a wafer based on the principle of changing properties when exposed to light. After development, the unexposed photoresist needs to be washed away with a stripping solution to expose the substrate for subsequent etching. Currently, most stripping solutions … Read more
In the electronics industry, printed circuit boards (PCBs) play a crucial role, and the outer layer processing of PCBs is a key factor that determines their performance and quality. It not only relates to the functionality of the circuit board but also directly affects the reliability and durability of the product. This article will detail … Read more