Process Flow of Rigid Multilayer Printed Circuit Boards
Compared to single-sided and double-sided boards, the process flow of rigid multilayer printed circuit boards is fraught with challenges, with significantly increased difficulty, mainly reflected in the following aspects: 1.Inter-layer alignment of multilayer wiring 2.Alignment of holes with inner layer patterns 3.Step slot formation 4.Warping of the board surface 5.Defects such as internal delamination, bubbling, … Read more
