Frustration with Circuit Board Troubles: A Bold Dissection!

Frustration with Circuit Board Troubles: A Bold Dissection!

The image below marks the position of the DDR2 chips that were cut open. We can see that there are dense traces inside the new foam. The BGA solder balls are marked in red. This is a 6-layer board, with the positions of the TOP, BOTTOM, and the four internal electrical layers already indicated. Since … Read more