In-Depth Analysis of the Current State of China’s Chip Packaging Industry (Including Potential Companies)

In-Depth Analysis of the Current State of China's Chip Packaging Industry (Including Potential Companies)

Continuing from the previous discussion, we previously conducted an in-depth analysis of the upstream materials and chip design industry in China, recommending companies with potential for the future. In this issue, we will discuss the current state of China’s chip packaging industry. The Chinese chip packaging industry is currently at a bottleneck in development. Some … Read more

The Most Comprehensive Introduction to Chip Packaging

The Most Comprehensive Introduction to Chip Packaging

Chip packaging, simply put, is the process of placing the integrated circuit die produced by the foundry onto a substrate that serves as a carrier, then bringing out the pins and securing the package into a whole. It protects the chip, acting as its shell, not only fixing and sealing the chip but also enhancing … Read more

Automotive Grade Chip Packaging Technology

Automotive Grade Chip Packaging Technology

Overview of Automotive Chips Automotive-grade semiconductors, commonly known as “automotive chips”, are semiconductors used in vehicle control devices, in-vehicle monitoring devices, and in-vehicle electronic control devices, among other fields. They are primarily distributed in vehicle control modules, in-vehicle infotainment systems, integrated powertrain control systems, active safety systems, and advanced driver-assistance systems. Compared to traditional fuel … Read more

Chip Packaging: SIP vs SOC

Chip Packaging: SIP vs SOC

Click the above“Mechanical and Electronic Engineering Technology” to follow us In the rapid development of electronic technology, chip packaging technology plays a crucial role. Today, we will explore two mainstream chip packaging technologies: SIP (System in Package) and SOC (System on Chip). These two technologies play a key role in the miniaturization, efficiency, and integration … Read more