Chip Packaging

Detailed Explanation of Semiconductor Chip Packaging and Testing Process

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Detailed Explanation of Semiconductor Chip Packaging and Testing Process

The chip packaging testing phase aims to process wafers that meet quality standards through precise cutting, wire bonding, and encapsulation processes to ensure electrical connections between the chip’s internal circuits and external devices, providing necessary mechanical and physical protection for the chip. Testing tools are used to conduct comprehensive and rigorous functional and performance testing … Read more

Understanding Chip Packaging Processes (Traditional Packaging)

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Understanding Chip Packaging Processes (Traditional Packaging)

In the previous issue, we introduced some background knowledge about chip packaging:A Beginner’s Guide to Chip PackagingIn this issue, we will focus on the specific process of packaging.As previously mentioned, there are many forms of packaging, including traditional and advanced packaging.Different packaging types have different processes and techniques. After completing the entire write-up, I found … Read more

Cleanroom Requirements for Chip Packaging and Testing Areas

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Cleanroom Requirements for Chip Packaging and Testing Areas

　　The cleanliness requirements for chip packaging and testing areas vary based on specific process steps and product characteristics, typically ranging from ISO Class 5 (100-level) to ISO Class 7 (10,000-level). Below are the cleanliness level classifications and criteria for different areas; let’s explore this together with Hejie Technology Cleanroom Engineering Company! 1. Cleanliness Requirements for … Read more

Four Bonding Methods in Chip Packaging

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Four Bonding Methods in Chip Packaging

Chip packaging is a critical step in semiconductor manufacturing, providing physical protection, electrical interconnection, and heat dissipation for chips. Bonding technology is the method of connecting bare chips to external materials. Currently, there are four main bonding technologies: the traditional and reliable Wire Bonding, the high-performance Flip Chip Bonding, the highly automated Tape Automated Bonding … Read more

In-Depth Analysis of the Current State of China’s Chip Packaging Industry (Including Potential Companies)

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In-Depth Analysis of the Current State of China's Chip Packaging Industry (Including Potential Companies)

Continuing from the previous discussion, we previously conducted an in-depth analysis of the upstream materials and chip design industry in China, recommending companies with potential for the future. In this issue, we will discuss the current state of China’s chip packaging industry. The Chinese chip packaging industry is currently at a bottleneck in development. Some … Read more

The Most Comprehensive Introduction to Chip Packaging

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The Most Comprehensive Introduction to Chip Packaging

Chip packaging, simply put, is the process of placing the integrated circuit die produced by the foundry onto a substrate that serves as a carrier, then bringing out the pins and securing the package into a whole. It protects the chip, acting as its shell, not only fixing and sealing the chip but also enhancing … Read more

Automotive Grade Chip Packaging Technology

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Automotive Grade Chip Packaging Technology

Overview of Automotive Chips Automotive-grade semiconductors, commonly known as “automotive chips”, are semiconductors used in vehicle control devices, in-vehicle monitoring devices, and in-vehicle electronic control devices, among other fields. They are primarily distributed in vehicle control modules, in-vehicle infotainment systems, integrated powertrain control systems, active safety systems, and advanced driver-assistance systems. Compared to traditional fuel … Read more

Chip Packaging: SIP vs SOC

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Chip Packaging: SIP vs SOC

Click the above“Mechanical and Electronic Engineering Technology” to follow us In the rapid development of electronic technology, chip packaging technology plays a crucial role. Today, we will explore two mainstream chip packaging technologies: SIP (System in Package) and SOC (System on Chip). These two technologies play a key role in the miniaturization, efficiency, and integration … Read more