PCB assembly

Three-Proof Coating Process for PCBA Printed Circuit Components!

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Three-Proof Coating Process for PCBA Printed Circuit Components!

Abstract With the rapid development of electronic products, the application fields of electronic devices are constantly expanding. From the past, where electromechanical products were limited to general industrial applications, to today, where electronic equipment is widely used in aerospace, navigation, military, and other fields. The broad application of electronic equipment means that higher requirements are … Read more

Key Considerations for Design for Manufacturability in SMT BGA PCB Assembly

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Key Considerations for Design for Manufacturability in SMT BGA PCB Assembly

The wiring formation process should include a formal design evaluation of the wiring details, with participation from as many relevant departments as possible within the company, such as manufacturing, assembly, and testing. The wiring scheme approved by representatives from the affected departments ensures that production-related factors have been considered in the design. The success of … Read more

Considerations for Testability Design in SMT BGA Printed Circuit Board Assembly

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Considerations for Testability Design in SMT BGA Printed Circuit Board Assembly

The design differences of contact points have varying impacts on contact quality and reliability, accessibility, and subsequent solderability, which are negligible for small contact points. 1. Component Testing As the BGA pitch and solder ball size decrease, the design of socket manufacturers faces increasing challenges to adequately test BGA packages. Socket manufacturers are focusing on … Read more

Considerations for Component Placement and Spacing in SMT BGA PCB Assembly Design

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Considerations for Component Placement and Spacing in SMT BGA PCB Assembly Design

To facilitate rework, it is recommended to provide sufficient spacing (3mm to 5mm) around the BGA. It is advisable to adopt the upper limit of the spacing, especially when CBGA uses a stepped stencil for solder paste deposition and when hot air is used for rework. However, if a diode laser system is used for … Read more