Trends in Semiconductor Packaging and Testing Technologies

Trends in Semiconductor Packaging and Testing Technologies

Follow our public account, click the top right corner of the public account homepage ” · · · “, set a star mark, and stay updated on the latest news in automotive semiconductors. There are many packaging forms for semiconductor devices, which can be classified into three categories based on their shape, size, and structure: … Read more

Bridging Chips and Circuit Boards – Packaging

Bridging Chips and Circuit Boards - Packaging

The development of packaging has evolved from the early DIP to the current 3D ICs [1][2], with a variety of packaging types emerging. Just the QF series has spawned a long list of types such as QFN (no leads), QFP (with leads)… There are many choices in terms of product applications [3], and each type … Read more