component spacing

Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with ‘ic’ Protection Level Assembly

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Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level Assembly

PCEC Technical Article As an option to reduce the spacing requirements for conductive components, when the pollution level is controlled to level 2 or lower, the spacing and component isolation of printed circuit boards with ‘ic’ protection level assembly can use the reduced spacing shown in Table 1 under the following conditions. That is, if … Read more

Considerations for Component Placement and Spacing in SMT BGA PCB Assembly Design

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Considerations for Component Placement and Spacing in SMT BGA PCB Assembly Design

To facilitate rework, it is recommended to provide sufficient spacing (3mm to 5mm) around the BGA. It is advisable to adopt the upper limit of the spacing, especially when CBGA uses a stepped stencil for solder paste deposition and when hot air is used for rework. However, if a diode laser system is used for … Read more