On April 22, the front page of the Shaoxing Daily reported: “Qili Semiconductor’s Advanced Packaging Technology Leads in China: Building Chips Like LEGO”. The full text is as follows ↓↓↓ Like stacking LEGO blocks, different specifications and characteristics of small chips are stacked together and packaged to form a complete chip, achieving characteristics such as … Read more
51 Microcontroller Hardware System The 51 microcontroller (such as the Intel 8051 series and its derivatives) is a classic8bit microcontroller widely used in embedded system development. 1.Central Processing Unit (CPU) Architecture: Based on an8bitCISC (Complex Instruction Set) architecture, with the core being theMCS51 instruction set. Functional Modules: Arithmetic Logic Unit (ALU): Performs arithmetic and logical … Read more
At Xiaomi’s spring launch event, the company officially unveiled its first professional imaging chip, the “Surge C1,” which features a dual-filter configuration that enables parallel processing of high and low-frequency signals, improving signal processing efficiency by 100%. Coupled with self-developed algorithms, the imaging performance of 3A (AF auto-focus, AWB auto white balance, AE auto exposure) … Read more
Earlier reports indicated that the Samsung S24 series would not only feature the Snapdragon 8 Gen 3 processor but also see the return of the Exynos series, with the S24 and S24+ expected to be equipped with the Samsung Exynos 2400 processor in certain regions of Europe and Asia. New information regarding the performance of … Read more
The Cortex-A55 processor is a mid-range low-power processor that utilizes the Armv8-A architecture. The diagram below illustrates the functional structure of this processor.Functional OverviewThe system registers of this CPU primarily provide the following functions: System control and configuration Memory Management Unit (MMU) configuration and management Cache configuration and management System performance monitoring Generic Interrupt Controller … Read more
1. PCB Inner Layer Defects – Open Circuits, Notches, Pinholes 1. Common Defects (Open Circuits, Notches, Pinholes) Image Description 1.1. Open Circuit due to Ink Peeling (caused by poor surface treatment affecting ink adhesion) 1.2. Notch in the Circuit (Pinholes on the Ink Surface after Coating) 1.3. Open Circuit (Debris on the Film Positioning) 1.4. … Read more
When designing PCBs, it is evident that the routing process is indispensable. The rationality of the routing not only determines the aesthetics of the PCB and its production costs but also reflects the performance of the circuit and its heat dissipation capabilities, as well as whether the performance of the components can be optimized. This … Read more
In microcontroller development, we often need to hand over the designed PCB files to the factory for production. Recently, one of our engineers encountered a troubling issue, as the PCB board lacked Mark points, resulting in deductions from the SMT factory. Today, we will discuss this topic: how important are Mark points in SMT processing? … Read more
The design of BGA (Ball Grid Array) on PCB boards is very common in the industry, and the issue of irregular BGA sizes can severely affect the soldering quality and electrical performance of PCBs. To effectively improve this issue, it is necessary to address it from the aspects of design and manufacturing processes.1. Package Design1. … Read more
PCB Panel Design: The Perfect Balance of Cost and Efficiency In PCB manufacturing, panel design directly affects production efficiency and cost. A reasonable panel scheme can increase SMT placement efficiency several times, while incorrect designs can lead to reduced processing speed or even production failure. This article will delve into the core points of PCB … Read more