On April 22, the front page of the Shaoxing Daily reported: “Qili Semiconductor’s Advanced Packaging Technology Leads in China: Building Chips Like LEGO”.
The full text is as follows
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Like stacking LEGO blocks, different specifications and characteristics of small chips are stacked together and packaged to form a complete chip, achieving characteristics such as small size, low power consumption, multifunctionality, and high computing power ratio. Since the launch of Qili Semiconductor (Shaoxing) Co., Ltd.’s Chiplet advanced packaging project in November last year, orders have been pouring in, with an expected annual sales of 60 million yuan this year.
As the number of components that can be integrated per unit area of a single chip approaches physical limits, the industry is exploring other paths to enhance chip performance. Chiplet technology is widely regarded as the next generation of chip development and an opportunity for China to overtake in the chip sector.
Recently, reporters visited Qili Semiconductor Company located in the Shaoxing area of the Hangzhou-Shaoxing-Linping Economic Integration Development Demonstration Zone, where precision equipment was operating efficiently in a cleanroom. A company representative introduced that starting from April 2024, after just six months of factory renovation, the first phase of the investment of 170 million yuan for the annual production line of 2 million large-size AI chip Chiplet packaging has been put into production, with products mainly used in fields with high computing power demands, including big data storage and computing, artificial intelligence, automotive electronics, radar, and communications.
Assembling several or dozens of chips together is no small feat. “Currently, domestic Chiplet advanced packaging generally faces issues such as incomplete data, immature processes, low product yield, high costs, and low design flexibility,” the representative said. The company’s team has been deeply involved in this field for over 10 years and has completed several domestically leading developments in large-size, high-performance XPU chip Chiplet packaging.
At present, Qili Semiconductor is continuously iterating on technology. The Qili Advanced Packaging Research Institute has formed a research and development team of over 40 people, establishing a talent hierarchy model led by core R&D leaders, with senior engineers guiding and key engineers developing and implementing. “We need to continuously break through in technology processes and product performance while accelerating the localization of equipment and materials,” the representative said.
Currently, the demand for high-performance chips is continuously growing. According to professional institutions, the global advanced packaging market size is expected to grow from 44.3 billion USD in 2022 to 78.6 billion USD in 2028, with a compound annual growth rate of 10.6%. This growth trend gives Qili Semiconductor great confidence, and with strong support from the Shaoxing area management committee, they are planning to launch a second phase project to further expand production capacity. It is reported that the total planned investment for the Qili Semiconductor advanced packaging project is 3 billion yuan, covering an area of 80 acres, and will be built in two phases. Once the second phase is fully operational, it is expected to achieve annual sales of 2 billion yuan.
Further Reading: “Advanced Semiconductor Packaging Technology and Market – 2024 Edition” “Chiplet Technology and Market – 2024 Edition”
