semiconductor technology

Dutch Chip Expert: China May Produce Domestic EUV Lithography Machines to Reach ASML’s Current Advanced Level in About 10 Years

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Dutch Chip Expert: China May Produce Domestic EUV Lithography Machines to Reach ASML's Current Advanced Level in About 10 Years

Click the blue text to follow us Scattering the eagle spirits, soaring across the land, With wisdom and courage, calling for the wisdom of China. —— “The State Council’s Tribute to Comrade Jiang Shangzhou” 01 Introduction Yang Rui, former host of the English channel of China Central Television, interviewed Dutch journalist and semiconductor observer Mark … Read more

Strong Competitors Emerge in Circuit Board Market, Demand May Be Impacted

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Strong Competitors Emerge in Circuit Board Market, Demand May Be Impacted

【PCB Information Network】According to reports from South Korean media ET News, there are rumors in the industry that Apple will launch its new smartphone, the iPhone 7 (tentative name), in the fall of 2016, which will feature chips using FOWLP packaging technology, making the new iPhone lighter and reducing manufacturing costs. Previously, Apple decided to … Read more

From Beginner to Abandonment: A Detailed Manufacturing Process of Chips!

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From Beginner to Abandonment: A Detailed Manufacturing Process of Chips!

In the previous issue, we introduced the wafer preparation process (link). Silicon ingots and wafers Today, we will continue to discuss the manufacturing process of chips (die). This stage is the most challenging part of the chip manufacturing process. I will try to explain it in a simple and understandable way, and I hope everyone … Read more

3D Printing Revolutionizes Chip ‘Nano Vessels’

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3D Printing Revolutionizes Chip 'Nano Vessels'

👆If you wish to meet regularly, feel free to star 🌟 and bookmark it~ The global chip industry may be on the brink of a revolutionary breakthrough! The research group led by Feng Jicheng at ShanghaiTech University (AIL) has successfully developed the world’s first “chip nano vessel 3D printer,” overcoming the processing bottleneck of next-generation … Read more

US Chip Sanctions Escalate, Advanced Packaging Becomes the Next Strategic Pivot for Domestic AI Chips

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US Chip Sanctions Escalate, Advanced Packaging Becomes the Next Strategic Pivot for Domestic AI Chips

Author | Du Wenjing, Chang Liang The AIGC led by large models marks the starting point of the Fourth Industrial Revolution, possessing the ability to fundamentally change the rules across various industries. The year 2023 has become the inaugural year for AI large models, with significant improvements in pre-training and generative capabilities, as well as … Read more

Qili Semiconductor’s Advanced Packaging Technology Leads in China: Building Chips Like LEGO

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Qili Semiconductor's Advanced Packaging Technology Leads in China: Building Chips Like LEGO

On April 22, the front page of the Shaoxing Daily reported: “Qili Semiconductor’s Advanced Packaging Technology Leads in China: Building Chips Like LEGO”. The full text is as follows ↓↓↓ Like stacking LEGO blocks, different specifications and characteristics of small chips are stacked together and packaged to form a complete chip, achieving characteristics such as … Read more

The 3-Nanometer Chip Crisis: How China Fights Back with Rare Earths and Quantum Technology Amid Japan’s Supply Cut of Photoresists

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The 3-Nanometer Chip Crisis: How China Fights Back with Rare Earths and Quantum Technology Amid Japan's Supply Cut of Photoresists

A silent technological war On April 3, 2025, a ban from the Japanese government shook the global semiconductor industry—export controls on EUV (Extreme Ultraviolet) photoresists to China. This seemingly ordinary chemical material actually chokes the throat of China’s 3-nanometer chip manufacturing. As I pored over the financial reports of Japan’s JSR Corporation late at night, … Read more

TSMC’s Decision to Skip High NA EUV for A14 Process

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TSMC's Decision to Skip High NA EUV for A14 Process

Chip project team founding team recruitment! ◀ Click to view! In the adoption of new elements in semiconductors, TSMC has been a pioneer for many years and often leads the trend. However, the company now seems to be abandoning the use of high numerical aperture (NA) EUV lithography equipment in its A14 process, opting instead … Read more

From Introduction to Abandonment: A Detailed Manufacturing Process of Chips!

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From Introduction to Abandonment: A Detailed Manufacturing Process of Chips!

Source: Fresh Date Classroom Original Author: Little Date Jun This article mainly introduces the process of chip manufacturing. Oxidation First, on the wafers that have been cut and polished, we need to perform an oxidation step. The purpose of oxidation is to form a protective film (oxide layer) on the fragile surface of the wafer. … Read more

Detailed Manufacturing Process of Chips

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Detailed Manufacturing Process of Chips

In the previous issue, we introduced the wafer preparation process (link). Silicon ingots and wafers Today, we will continue discussing the manufacturing process of chips (die). This stage is the most challenging part of the chip manufacturing process. I will try to explain it in a simple and understandable way, and I hope everyone can … Read more