Breakthrough in Chip Manufacturing Limits Without Relying on EUV Lithography Machines
Source:China Science Daily
semiconductor technology
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The world’s first 3nm chip has been born, surprisingly not led by TSMC, sparking heated discussions in the tech community. Will TSMC’s dominant position in technology face its final chapter? According to relevant media reports, Samsung’s fully wrapped gate 3nm chip has officially debuted. As the first company to break the industry’s technological ceiling, Samsung … Read more
Is the Chip War About to Fail? $400 Billion Profit Handed to the U.S., Foreign Media Warns of Potential Catastrophe!
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Must-See! The Performance Showdown of Mobile Chips in 2025: Who is the True King of Hearts?
Nowadays, mobile phones have become an indispensable part of our lives. Whether for gaming, studying, or daily socializing, the performance of a mobile phone is crucial. The core that determines the performance of a mobile phone is the mobile chip. Today, we will delve into the rankings of popular mobile chips and explore their powerful … Read more
Hardware News: Intel’s 3D PLC Flash Memory Research and Upcoming Developments
News 1:Intel is researching 3D PLC flash memory, firmly sticking to the floating gate structure. Although QLC flash memory has not yet been widely adopted, with few SSDs on the market using QLC, flash manufacturers are already preparing for the next generation of PLC flash memory. Last month, Toshiba showcased its PLC plans at the … Read more
Company News | New Breakthrough! Zhuhai Haoze Technology Successfully Tapes Out Its First Ultra-Performance AI Chip with Integrated Storage and Computing
▷ Comprehensive report from Zhuhai Guanhai MediaRecently, reporters learned from Zhuhai Haoze Technology Co., Ltd. (referred to as “Haoze Technology”), located in the Zhuhai Huafa Zhihui Bay Industrial Park, that this leading domestic company in the field of integrated storage and computing AI vision chips has made significant progress inedge intelligent technology. Its self-developed first … Read more
TSMC Process Nodes for 2025
Process Node Process Type Technical Features 2nm Logic, Nanosheet (0.75V, shrink) Utilizes nanosheet technology with a 0.75V operating voltage and shrink characteristics, which helps improve chip integration and performance. 3nm Logic, Fin FET (0.75/1.2V, shrink)Logic, Fin FET (0.75/1.2V, Non-shrink) Based on Fin Field Effect Transistor technology, it offers different voltage combinations (0.75/1.2V) with both shrink … Read more
In-Depth Analysis of the Current State of China’s Chip Packaging Industry (Including Potential Companies)
Continuing from the previous discussion, we previously conducted an in-depth analysis of the upstream materials and chip design industry in China, recommending companies with potential for the future. In this issue, we will discuss the current state of China’s chip packaging industry. The Chinese chip packaging industry is currently at a bottleneck in development. Some … Read more
100% Self-Designed Architecture! Successful Tape-Out of the New Loongson CPU with Double Performance of the Second-Generation Self-Developed GPU
The official announcement from Loongson Technology states that recently, the Loongson 2K3000 and Loongson 3B6000M have successfully completed tape-out, and preliminary functionality and performance assessments have been completed, with all indicators meeting expectations. The Loongson 2K3000 and Loongson 3B6000M are different packaging versions based on the same silicon wafer, targeting the industrial control application field … Read more
Wafer Processing Manufacturer Shares: Detailed Explanation of 2.5D/3D Packaging PPT
Company Overview: Suzhou Senhui Semiconductor, supported by a strong research and technology team, focuses on providing complete process solutions and wafer processing services for global compound semiconductor customers. The team members have been deeply involved in the semiconductor industry for many years, possessing decades of rich experience in photolithography, thin film processes, epitaxy, bonding processes, … Read more