Recently, it was officially announced that Xiaomi’s self-developed mobile SoC chip has been named “Xuanjie O1” and will be released in late May. This sudden emergence of a self-developed chip has surprised many, and Lei Jun specifically emphasized that this chip is designed and developed independently by Xiaomi. Xiaomi has done an excellent job of … Read more
Today, let’s dive into some hardcore content! 🔥 With the help of this chip fabrication cost evolution chart, we will understand how chip manufacturing has been “spending money like water” from 90nm to 5nm. Whether you are a newly minted electronic engineer or a chip investment analysis enthusiast, after reading this, you will confidently say: … Read more
Click the blue text to follow us Scattering the eagle spirits, soaring across the land, With wisdom and courage, calling for the wisdom of China. —— “The State Council’s Tribute to Comrade Jiang Shangzhou” 01 Introduction Yang Rui, former host of the English channel of China Central Television, interviewed Dutch journalist and semiconductor observer Mark … Read more
【PCB Information Network】According to reports from South Korean media ET News, there are rumors in the industry that Apple will launch its new smartphone, the iPhone 7 (tentative name), in the fall of 2016, which will feature chips using FOWLP packaging technology, making the new iPhone lighter and reducing manufacturing costs. Previously, Apple decided to … Read more
In the previous issue, we introduced the wafer preparation process (link). Silicon ingots and wafers Today, we will continue to discuss the manufacturing process of chips (die). This stage is the most challenging part of the chip manufacturing process. I will try to explain it in a simple and understandable way, and I hope everyone … Read more
👆If you wish to meet regularly, feel free to star 🌟 and bookmark it~ The global chip industry may be on the brink of a revolutionary breakthrough! The research group led by Feng Jicheng at ShanghaiTech University (AIL) has successfully developed the world’s first “chip nano vessel 3D printer,” overcoming the processing bottleneck of next-generation … Read more
Author | Du Wenjing, Chang Liang The AIGC led by large models marks the starting point of the Fourth Industrial Revolution, possessing the ability to fundamentally change the rules across various industries. The year 2023 has become the inaugural year for AI large models, with significant improvements in pre-training and generative capabilities, as well as … Read more
On April 22, the front page of the Shaoxing Daily reported: “Qili Semiconductor’s Advanced Packaging Technology Leads in China: Building Chips Like LEGO”. The full text is as follows ↓↓↓ Like stacking LEGO blocks, different specifications and characteristics of small chips are stacked together and packaged to form a complete chip, achieving characteristics such as … Read more
A silent technological war On April 3, 2025, a ban from the Japanese government shook the global semiconductor industry—export controls on EUV (Extreme Ultraviolet) photoresists to China. This seemingly ordinary chemical material actually chokes the throat of China’s 3-nanometer chip manufacturing. As I pored over the financial reports of Japan’s JSR Corporation late at night, … Read more
Chip project team founding team recruitment! ◀ Click to view! In the adoption of new elements in semiconductors, TSMC has been a pioneer for many years and often leads the trend. However, the company now seems to be abandoning the use of high numerical aperture (NA) EUV lithography equipment in its A14 process, opting instead … Read more