Follow our public account, click the top right corner of the public account homepage ” · · · “, set a star mark, and stay updated on the latest news in automotive semiconductors. There are many packaging forms for semiconductor devices, which can be classified into three categories based on their shape, size, and structure: … Read more
👆If you would like to meet regularly, feel free to star 🌟 and bookmark it~Source: This article is translated from semiengineering, thank you. Intel’s foundry, TSMC, and Samsung Foundry are competing to provide all the essential components for complete 3D-ICs, which will achieve significant performance improvements with minimal power consumption in the coming years. Much … Read more
Introduction: A Manufacturing Revolution from “Millimeter” to “Micrometer” Scale As Moore’s Law approaches its physical limits, the main battleground for increasing chip integration has shifted from wafer processing to advanced packaging. The rise of System-in-Package (SiP), 3D stacking, and heterogeneous integration technologies presents unprecedented challenges for micrometer-level interconnection processes. Traditional stencil printing is limited by … Read more
Author | Du Wenjing, Chang Liang The AIGC led by large models marks the starting point of the Fourth Industrial Revolution, possessing the ability to fundamentally change the rules across various industries. The year 2023 has become the inaugural year for AI large models, with significant improvements in pre-training and generative capabilities, as well as … Read more
On April 22, the front page of the Shaoxing Daily reported: “Qili Semiconductor’s Advanced Packaging Technology Leads in China: Building Chips Like LEGO”. The full text is as follows ↓↓↓ Like stacking LEGO blocks, different specifications and characteristics of small chips are stacked together and packaged to form a complete chip, achieving characteristics such as … Read more
Recently, the trade friction between China and the United States has intensified, prompting the Chinese government to respond swiftly with a series of countermeasures. The China Semiconductor Industry Association issued an important notice on April 11, requiring all imported chips to clearly label their country of origin to complete customs procedures. This move not only … Read more
The storage industry will be the key to the semiconductor industry’s overall value surge in 2024. Since the second half of 2022, the entire semiconductor industry has begun to show marginal loosening, and in 2023, it entered a downward phase, experiencing approximately 5 quarters of cyclical decline. Historical data shows that the downward trend in … Read more
Tungsten in the field of PCB (Printed Circuit Boards) is primarily applied in interconnection materials and advanced packaging technologies. Its high electrical conductivity, high-temperature resistance, and anti-electromigration properties make it a critical material. Below is a detailed analysis of applications and consumption: 1.Core Application Scenarios (1)Interconnection Materials and Via Filling Tungsten forms conductive layers for … Read more
1、Summary of “In the Era of DeepSeek, ASIC Chips Crowned as Kings” ■ With rapid iterations of models like GPT-4.5, Grok-3, Claude 3.5, and LLaMA 4, the number of domestic generative AI users has surpassed 300 million, leading to a massive demand for inference computing power. ■ NPU (Edge AI) is suitable for terminal devices … Read more
According to a report by Taiwan’s “China Times News” on January 8, the technology of connecting several chips with different functions using advanced packaging technology to achieve the functionality of advanced process chips, known as small chips (or die), is seen as a shortcut for China to break through the US chip technology embargo. Jiangsu … Read more