Implementing Responsible Edge AI Deployment with NXP

Implementing Responsible Edge AI Deployment with NXP

Learn how NXP responsibly supports edge AI, focusing on ethical considerations, privacy, security, and fairness in embedded machine learning applications. www.nxp.com While some people first consider how to make AI work, NXP goes beyond expectations and asks a question: How can we make AI work in a safe, reliable, and responsible manner? This is where … Read more

NXP Plans to Close Four 8-Inch Factories, Accelerating Transition to 12-Inch Production

NXP Plans to Close Four 8-Inch Factories, Accelerating Transition to 12-Inch Production

Follow “Electronic Engineering Magazine” and add the editor’s WeChat The regional groups are now open, please send a message with 【Shenzhen】【Shanghai】【Beijing】【Chengdu】【Xi’an】 to the public account Currently, leading manufacturers are accelerating the transition to 12-inch wafer production. According to a recent report by the Dutch local media “de Gelderlander”, semiconductor giant NXP plans to close several … Read more

Major Chip Design Companies in Guangdong and Their Industry Impact

Major Chip Design Companies in Guangdong and Their Industry Impact

Welcome to follow our public account for continuous meaningful information: Guangdong Province, as an important base for China’s semiconductor industry, especially in the field of chip design, is home to many influential companies. The chip design companies in Guangdong are mainly concentrated in Shenzhen and Guangzhou, forming a relatively complete industrial chain. Shenzhen HiSilicon Technologies … Read more

Alphawave’s First UCIe IP Subsystem Based on TSMC 2nm Successfully Taped Out

Alphawave's First UCIe IP Subsystem Based on TSMC 2nm Successfully Taped Out

On June 5, semiconductor IP company Alphawave Semi announced that its UCIe IP subsystem has successfully taped out, utilizing TSMC’s 2nm (N2) process, supporting a 36G Die-to-Die data rate. This IP is fully integrated with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology, unlocking breakthrough bandwidth density and scalability for next-generation chiplet architectures. This milestone builds on … Read more

Aojie Press Conference Involves 14 Q&As: 6nm 4G Mobile Chip Tape-Out in June

Aojie Press Conference Involves 14 Q&As: 6nm 4G Mobile Chip Tape-Out in June

1. Mr. Dai, how many design-ins and design-wins does the company’s octa-core mobile chip have in OEM factories, and when will the mobile phones equipped with the company’s octa-core chip be launched? The company’s first 4G octa-core chip has been designed into multiple projects in mobile and other non-mobile fields, and the progress is going … Read more

Successful Tape-Out of Loongson 3B6000 Processor

Successful Tape-Out of Loongson 3B6000 Processor

Recently, the Loongson 2K3000 (3B6000M) has completed preliminary functionality and performance assessments, with all indicators meeting expectations. The Loongson 2K3000 and Loongson 3B6000M are different packaging versions based on the same silicon wafer, targeting industrial control applications and mobile terminal fields, respectively.The chip integrates 8 LA364E processor cores, achieving a measured SPEC CPU 2006 Base … Read more

In-Depth Study | Understanding Cybersecurity AI Agents and Multi-Agent Systems

This article contains 8284 words, estimated reading time is 21 minutes. · Abstract ·With the acceleration of digital transformation and the exponential increase in the complexity of cyber threats, security operation models are gradually shifting from single-product defenses and rule-driven approaches to a data-driven and AI-empowered intelligent defense era. Major cybersecurity vendors have launched their … Read more

AI Applications Drive Growth in Printed Circuit Board (PCB) Cycle, Accelerating High-Frequency High-Speed Copper Clad Laminate (CCL) Development

AI Applications Drive Growth in Printed Circuit Board (PCB) Cycle, Accelerating High-Frequency High-Speed Copper Clad Laminate (CCL) Development

Printed Circuit Boards (PCBs) are critical electronic interconnect components used in nearly all electronic products. They are indispensable electronic components in modern electronic information products, often referred to as the “mother of electronic products.” The global market size is expected to exceed $70 billion by 2024. Copper clad laminates (CCLs), one of the highest cost … Read more

PCB Giant: Dual-Driven Growth through Technology and Globalization, Valuation Recovery and Performance Growth Resonance

PCB Giant: Dual-Driven Growth through Technology and Globalization, Valuation Recovery and Performance Growth Resonance

1. Company Fundamentals: Performance Reversal Imminent, Valuation at Historical Low 1. Financial Data Overview Oshkosh (002913) achieved a revenue of 4.566 billion yuan in 2024 (up 5.45% year-on-year), but the net profit attributable to shareholders decreased by 31.88% to 353 million yuan due to rising raw material prices, exchange rate fluctuations, and initial production costs … Read more

Overview of the PCB Industry: Riding the AI Wave Towards a $100 Billion Market, with a Solid Foundation in Chinese Manufacturing

Overview of the PCB Industry: Riding the AI Wave Towards a $100 Billion Market, with a Solid Foundation in Chinese Manufacturing

Driven by applications in artificial intelligence, servers and data storage, network communication, and automotive electronics, the global PCB industry has entered a new growth cycle, with the market size expected to reach $100 billion by 2030. Open-source large models like DeepSeek have significantly reduced deployment costs and barriers across various industries, leading to a rapid … Read more