The smartphones and computers you use daily rely on a crucial yet often overlooked process—testing. A chip undergoes a series of rigorous tests from wafer to finished product, ensuring it operates without overheating and has low failure rates, while also validating that all functions and performance metrics meet standards. This document on wafer and chip … Read more
Chip tape out (Tape Out) is the core step in transforming integrated circuit design into physical chips, involving design verification, process manufacturing, and sample testing, which directly determines the success rate of chip mass production. The name originates from the early tradition of “streaming” design drawings to tapes, which has now evolved into the entire … Read more
Click on the title below “Guo Xin Nan Fang” for quick follow-up Source: Semiconductor Chip News In 2020, the “Several Policies for Promoting High-Quality Development of the Integrated Circuit Industry and Software Industry in the New Era” was issued, marking the first time the Chinese government split testing and packaging companies into separate entities, indicating … Read more
Today, semiconductor companies face severe challenges related to shrinking technology nodes, expanding design scales, and broadening system scales (known as the “three major scaling challenges”). These challenges have a wide-ranging impact on design development, manufacturing, and functional operations, all of which affect the company’s operating profits. At the same time, the complexity of large System … Read more
Source: Semika Original Author: Semika This article provides a detailed introduction to chip testing. Chip testing can be broadly divided into two main parts: CP (Chip Probing) and FT (Final Test). Some chips also undergo SLT (System Level Test). Additionally, some specific chips require reliability testing. CP Testing CP (Chip Probing) testing, also known as … Read more
Source: Content from WeChat public account “Hushan Capital“, thank you. The most basic steps in making a chip are design -> tape-out -> packaging -> testing. The cost composition of a chip is generally 20% labor cost, 40% tape-out, 35% packaging, and 5% testing【For advanced processes, tape-out costs may exceed 60%】. Testing is actually the … Read more
Chip tape out (Tape Out) is the core step in transforming integrated circuit design into physical chips, involving design verification, process manufacturing, and sample testing, which directly determines the success rate of chip mass production. The name originates from the early tradition of “streaming” design drawings to magnetic tapes, which has now evolved into the … Read more
DAP and JTAG There are various ways to connect to the Debug Access Port (DAP), which differ in cost, invasiveness, and security. The DAP allows access to the core within the chip, which is typically the first to boot or is a dedicated microprocessor used for managing chip boot, debugging, and initializing DVFS and DRAM … Read more
On June 11, 2025, Huawei made a stunning debut with the Pura 80 series smartphones, quickly becoming the focus of the tech world. From design to performance, this series showcases Huawei’s innovative strength, with many highlights drawing attention. Behind this series of outstanding performances lies an ‘unsung hero’—the high-frequency probes, which play a crucial role … Read more
In the complex journey of chip development, Post-Silicon Validation (PSV) plays a crucial role. Once the chip transitions from design blueprints to actual silicon wafers, PSV becomes the core process to verify whether it meets the expected functionality and performance. From a technical perspective, PSV primarily involves inputting various test vectors into the chip to … Read more