(Friends who are not interested in the technical background can skip directly to the practical content below) 1. Definition and Significance of Wafer Fabrication Wafer fabrication is the core process of semiconductor manufacturing, referring to the submission of chip design layout data to a wafer foundry for trial production. Through processes such as photolithography, etching, … Read more
Precision ceramic components are key parts of core equipment in several critical processes of semiconductor manufacturing, such as lithography, etching, thin film deposition, ion implantation, and CMP, including bearings, guide rails, liners, electrostatic chucks, and mechanical handling arms. They play supporting, protective, and guiding roles, especially within the equipment chambers. Usage of Advanced Ceramics in … Read more
1 Case Situation A semiconductor manufacturing plant generates a large amount of wastewater containing heavy metals during production, including copper, nickel, zinc, and lead, which pose serious potential hazards to the environment. The plant’s original wastewater treatment system, while capable of removing some pollutants, is ineffective in removing heavy metals, resulting in wastewater that cannot … Read more
In the previous issue, we introduced some background knowledge about chip packaging:A Beginner’s Guide to Chip PackagingIn this issue, we will focus on the specific process of packaging.As previously mentioned, there are many forms of packaging, including traditional and advanced packaging.Different packaging types have different processes and techniques. After completing the entire write-up, I found … Read more
Hello, everyone. Today we will take a look at the hazardous chemicals in semiconductor manufacturing—Ammonium Ferrous Sulfate. 1. Basic Information Chemical Name in Chinese: 硫酸亚铁铵。 Chemical Name in English: FERROUS AMMONIUM SULFATE; Ammonium iron sulfate; Mohr’s salt. Molecular Formula: Fe2H8N2O4S; Fe2(NH4)2SO4. Molecular Weight: 392.1308. CAS No.: 2310045-89-3. 2. Composition/Information on Ingredients Composed of ammonium ions, … Read more
1. Technical Background and Evolutionary Drivers In semiconductor manufacturing, interconnect technology is a key factor determining chip performance. Early aluminum interconnects could not meet the requirements for processes below 0.18 microns due to high resistivity (2.82 μΩ·cm) and electromigration issues. Copper, with its lower resistivity (1.68 μΩ·cm) and significantly stronger resistance to electromigration (over 10 … Read more
Process Node Technical Details Results and Advantages Application Areas 90nm CMOS 1. First to mass produce this technology on 300mm wafers.2. Developed three optimized process flows for manufacturing products with different requirements.3. Reduced transistor gate width to 37nm, allowing different threshold transistors to be placed on the same die.4. Utilized industry-leading (37nm) gate lengths, high-efficiency … Read more
From fresh food preservation packaging to the battery efficiency of new energy vehicles, from precision semiconductor manufacturing to green energy innovation, vacuum technology has become a core force driving industrial upgrades. As the Chinese headquarters of the global leader in vacuum technology, ULVAC Group, located in Xinzhuang Town, Minhang District, Applied Materials Group (hereinafter referred … Read more
1. What is Tape-Out Tape-out, in English, refers to the process of converting the layout of a designed integrated circuit (IC) into an actual chip, similar to a production line, through a series of manufacturing steps. Tape-out, which means sending for manufacturing, is the final stage of integrated circuit design, where the chip design company … Read more
The Core Concepts of Real-Time Scheduling (RTS) in Semiconductor Manufacturing The Necessity of Advanced Scheduling Semiconductor manufacturing is one of the most complex and capital-intensive industries globally. Its production process involves hundreds or even thousands of steps, characterized by significant re-entrant flow, where wafers need to return multiple times to the same equipment group for … Read more