AI ASIC Articles

Xinyuan Co., Ltd.: Leading Domestic AI ASIC Company Seizing New Heights in Autonomous Computing Innovation

2026-07-13 by boardor

Xinyuan Co., Ltd. (688521.SH) is a company that relies on its proprietary semiconductor IP to provide customers with platform-based, comprehensive, and one-stop chip customization services and semiconductor IP licensing services. The company’s business revenue mainly comes from IP licensing and one-stop chip customization, including mass production. The company’s IP licensing business holds the largest market … Read more

Broadcom: AI ASIC Growth Exceeds Expectations, Strong Growth Potential from Scale Up/Out/Across

2026-05-11 by boardor

【Dongwu Electronics Chen Haijin】Broadcom: AI ASIC growth exceeds expectations, strong growth potential from Scale Up/Out/Across 🥇Event: Broadcom released FY25Q3 performance. 📍The quarter achieved revenue of $16 billion, a 22% year-on-year increase, exceeding analyst expectations of $15.84 billion. Among them, semiconductor solutions revenue was $9.2 billion, a 26% increase, while analysts expected $9.1 billion; AI revenue … Read more

From ‘General’ to ‘Customized’: AI ASIC is Redefining Chip Competition Rules

2026-01-12 by boardor

As the cost of computing power for training large models reaches tens of millions of dollars, and the power consumption of a single GPU exceeds 700 watts, the cost-performance bottleneck of ‘general-purpose chips’ is gradually becoming apparent. At this time, a chip tailored for specific AI tasks—AI ASIC—has become a new choice for tech giants … Read more

Tesla Considers Shifting Dojo 3 Chip Production from TSMC to Samsung and Intel

2026-01-09 by boardor

On August 8, local media ZDNET Korea reported that Tesla is considering a complete supply chain overhaul for its third-generation self-developed AI ASIC chip, Dojo 3, with Samsung Foundry taking on the front-end advanced process manufacturing, while the back-end advanced packaging will be handled by Intel. It is noted that Tesla’s Dojo 1 chip was … Read more

Detailed Explanation of Chip Tape Out: The Life and Death Transition of Hundreds of Millions of Transistors — The Ultimate Game from Design to Mass Production

2026-01-04 by boardor

Chip tape out (Tape Out) is the core step in transforming integrated circuit design into physical chips, involving design verification, process manufacturing, and sample testing, which directly determines the success rate of chip mass production. The name originates from the early tradition of “streaming” design drawings to magnetic tapes, which has now evolved into the … Read more

What is Tape-Out?

2026-01-04 by boardor

Reading Good Books Together What is Tape-Out? Tape-out refers to the process of manufacturing chips through a series of steps on a production line. It is the final stage of integrated circuit design, known as ‘trial production.’ In simple terms, after the circuit design is completed, a small batch is produced for testing purposes. If … Read more

A Comprehensive Comparison of ASICs and FPGAs

2026-01-01 by boardor

Word count: 9449, reading time approximately 48 minutes ASICs vs. FPGAs: A Comprehensive Comparison As key components in modern computing, the choice between ASICs and FPGAs is significant, highlighting the importance of understanding their unique advantages and trade-offs in an ever-evolving digital landscape. Now is the best time to delve into custom chip design, with … Read more

Summary of Expert Discussions on ASIC Chips

2026-01-01 by boardor

Q: What is the progress and mass production schedule for Broadcom’s main cooperative chips? A: Broadcom has a total of seven main and potential cooperative customers, each with different progress and mass production schedules. Among them, Google, Meta, and OpenAI are mass production customers this year. Google has already mass-produced multiple generations of chips and … Read more