MediaTek’s First 2nm Chip to Tape Out in September, Manufactured by TSMC

MediaTek's First 2nm Chip to Tape Out in September, Manufactured by TSMC

According to IT Home, on May 20, the Commercial Times published a blog post reporting that at the 2025 Taipei International Computer Show, MediaTek’s CEO Cai Lixing announced its first 2nm chip, which is expected to tape out in September 2025. Note from IT Home: Tape Out refers to the process of converting the designed … Read more

Fundamentals of Tape-Out in Integrated Circuit Design

Fundamentals of Tape-Out in Integrated Circuit Design

1. What is Tape-Out Tape-out, in English, refers to the process of converting the layout of a designed integrated circuit (IC) into an actual chip, similar to a production line, through a series of manufacturing steps. Tape-out, which means sending for manufacturing, is the final stage of integrated circuit design, where the chip design company … Read more

Domestic Chip Design Companies Break Through in Tape-Out

Domestic Chip Design Companies Break Through in Tape-Out

Click the blue text to follow us From a single chip to mass production, tape-out determines whether the chip design can be utilized. Each successful tape-out signifies a successful chip design. Since the beginning of this year, many domestic companies have announced successful tape-outs, which undoubtedly demonstrate significant progress in domestic chip development. In the … Read more

Market Value Soars by 1.5 Billion! Longxin’s Next-Generation Laptop CPU Successfully Taped Out: GPU Performance Doubles, Key AI Processor Design Technologies Mastered

Market Value Soars by 1.5 Billion! Longxin's Next-Generation Laptop CPU Successfully Taped Out: GPU Performance Doubles, Key AI Processor Design Technologies Mastered

By | Zhou Luyao On April 3, 2025, Longxin Zhongke (688047.SH) officially announced on its WeChat public account that the Longxin 2K3000 (3B6000M) has successfully completed tape-out, achieving preliminary functionality and performance assessments, with all indicators meeting expectations. The Longxin 2K3000 and Longxin 3B6000M are different packaging versions based on the same silicon wafer, targeting … Read more

The Semiconductor Jargon World: A Guide from Tape-Out to Packaging Testing

The Semiconductor Jargon World: A Guide from Tape-Out to Packaging Testing

Hello everyone, I am Chip Language. Today, let’s dive into the world of chip cultivation—from design to mass production, chips must go through numerous challenges: Tape-Out is the foundation, packaging testing is the tribulation, and yield is the ascension KPI… The fate of engineers is to protect the chips while sacrificing their hair for merit. … Read more

Zhuhai! First of Its Kind! Successful Tape-Out!

Zhuhai! First of Its Kind! Successful Tape-Out!

[Image][Image][Image] The first ultra-performance storage-computing integrated AI chip VVT300 has successfully completed its tape-out. Haotze Technology Co., Ltd., located in the Zhuhai High-tech Zone, announced that its self-developed first ultra-performance storage-computing integrated AI chip VVT300 has successfully completed tape-out. [Image] This chip is based on an innovative distributed storage-computing integrated architecture and utilizes Haotze Technology’s … Read more