Reliability Testing

CXL Poison Injection Merged into Linux 6.18: A Reliability Testing Tool for Persistent Memory Devices

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Abstract The Compute Express Link (CXL) subsystem has incorporated several improvements in Linux 6.18, most notably the mainlining of the Poison Injection feature. This functionality allows user space to inject “poison” bits into CXL physical addresses through a newly created kernel-side interface, simulating device errors and validating the hardware/software exception handling paths. Additionally, the patch … Read more

Technical Article: Thermal Stress of PCB Substrates

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Technical Article: Thermal Stress of PCB Substrates

Thermal stress is a type of mechanical stress generally caused by temperature changes that prevent an object from expanding or contracting freely, resulting in internal stress within the object. When an object is subjected to external constraints or internal parts are mutually restrained, factors such as temperature gradients, restricted thermal expansion and contraction of materials, … Read more

Chip Testing: A Comprehensive Overview

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Chip Testing: A Comprehensive Overview

Source: Semika Original Author: Semika This article provides a detailed introduction to chip testing. Chip testing can be broadly divided into two main parts: CP (Chip Probing) and FT (Final Test). Some chips also undergo SLT (System Level Test). Additionally, some specific chips require reliability testing. CP Testing CP (Chip Probing) testing, also known as … Read more

What Tests Are Required for Chips?

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What Tests Are Required for Chips?

Source: Content from WeChat public account “Hushan Capital“, thank you. The most basic steps in making a chip are design -> tape-out -> packaging -> testing. The cost composition of a chip is generally 20% labor cost, 40% tape-out, 35% packaging, and 5% testing【For advanced processes, tape-out costs may exceed 60%】. Testing is actually the … Read more

Overview of PCB/PCBA Reliability and Failure Analysis

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Overview of PCB/PCBA Reliability and Failure Analysis

The reliability testing and failure analysis of PCB / PCBA proceed hand in hand; when design pressures reach their limits, thorough inspection and analysis are needed to determine their failure modes. Some of these tests and potential failure causes are handled by manufacturers, as they may arise during the bare board manufacturing process, while other … Read more

Avoid Pitfalls: ESD Testing is Essential for Embedded Electronic Product Development

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Avoid Pitfalls: ESD Testing is Essential for Embedded Electronic Product Development

Hello everyone, I am the Intelligence Guy~ First of all,Electrostatic Discharge (ESD),is the phenomenon of charge transfer that occurs when objects with different static electric potentials come close to or directly contact each other.ESD testing isa type of reliability testing for electronic products, measuring the product/system’s resistance to ESD interference. ESD can cause your embedded … Read more

Jiehe Technology’s Industrial Computer AF208: Building a High-Reliability Testing Line for New Energy Vehicles

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Jiehe Technology's Industrial Computer AF208: Building a High-Reliability Testing Line for New Energy Vehicles

Industry Background According to market research institutions, it is predicted that within the next five years, the demand for key components in the new energy vehicle market will grow at a rate of over 20% per year. With such enormous market demand, automotive suppliers need to closely monitor every production line and quickly upgrade them … Read more

Multi-Wordline Activation in DRAM CP Testing

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Multi-Wordline Activation in DRAM CP Testing

Part One: Evolution of DRAM Technology and Wafer-Level Testing 1.1 Duality of DRAM Feature Size Shrinkage Dynamic Random Access Memory (DRAM) serves as the core storage component of modern computing systems, with its technological evolution consistently advancing towards high density and high performance goals. From DDR1 to DDR5, the generational iterations have seen exponential increases … Read more

Overview of Quality Design and Control in Semiconductor Product Development Phase

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Overview of Quality Design and Control in Semiconductor Product Development Phase

Introduction: The quality design and control during the semiconductor product development phase is crucial for ensuring product success, high reliability, and cost-effectiveness. For large semiconductor companies (such as Toshiba, ON, Samsung, Renesas, Vishay, ADI, etc.), this is not merely about simple quality inspection, but rather a systematic engineering process that spans the entire product lifecycle. … Read more

Methodologies for Reliability Testing of PCBA in SMT

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Methodologies for Reliability Testing of PCBA in SMT

“The key core that affects product quality and user experience — the reliability of PCBA“ In the field of electronic manufacturing, the reliability of PCBA (Printed Circuit Board Assembly) directly relates to product quality and user experience. Below, let’s explore 5 commonly used methods for PCBA reliability testing. Burn-in Testing —————— Burn-in testing is based … Read more