In the first half of 2025, Changchuan Technology appeared to be thriving, with revenue soaring to 2.167 billion, a 41.8% increase; net profit grew to 427 million, nearly doubling, with a year-on-year increase of 98.73%. In the domestic semiconductor equipment sector, this growth rate is indeed impressive. For comparison, the net profit growth rate of … Read more
Aside from the net increase of short positions in the CSI 50 not exceeding 1,000 lots, the other two indices have a net increase of around 2,000 lots. The Shanghai Composite Index is now very close to the previous high of 3,674.Recently, the popular stocks that performed well on the same day mostly required chasing … Read more
The field of semiconductor packaging continues to heat up, with advanced packaging technologies becoming a core support for cutting-edge areas such as AI and HPC. In particular, the CoWoS technology, due to its compatibility with HBM and AI chip integration requirements, is monopolized by TSMC for top-tier AI chip services globally. Domestic manufacturers are accelerating … Read more
With the increasing performance demands of chips driven by technologies such as AI, 5G, and autonomous driving, traditional packaging methods are gradually losing their advantages. An emerging technology—Hybrid Bonding—is becoming a key breakthrough in advanced packaging. It is reshaping the way chips connect, becoming the core process for high-performance computing, high-bandwidth memory (HBM), and ultra-high-layer … Read more
As Moore’s Law approaches its physical limits, advanced packaging has become the core path for the semiconductor industry to break through performance bottlenecks. Emerging applications such as 5G, artificial intelligence (AI), high-performance computing (HPC), autonomous driving, and the Internet of Things (IoT) continuously elevate the demands for chip speed, bandwidth, power consumption, and system integration. … Read more
Friends, let’s talk about the recent hot topic in the semiconductor circle—advanced packaging. In this era of constant innovation in the industry, it has become increasingly difficult to enhance performance solely by reducing chip size due to physical limitations. At this moment, advanced packaging technology emerges as a refreshing stream, taking center stage and becoming … Read more
The semiconductor manufacturing process can be divided into front-end and back-end processes. The front-end process mainly involves wafer manufacturing, while the back-end process primarily focuses on packaging and testing. Among these, packaging (Package) in the back-end process refers to a series of technical methods that connect tested integrated circuit bare chips (Die) to external circuits, … Read more
ICCCAS 2025 The 14th IEEE International Conference on Communications, Circuits and Systems (ICCCAS 2025) will be grandly held in Wuhan from May 23 to 25, 2025, co-hosted by IEEE, Wuhan University of Technology, and University of Electronic Science and Technology of China. A total of 170 scholars and researchers from universities and research institutions in … Read more
Follow our public account, click the top right corner of the public account homepage ” · · · “, set a star mark, and stay updated on the latest news in automotive semiconductors. There are many packaging forms for semiconductor devices, which can be classified into three categories based on their shape, size, and structure: … Read more
👆If you would like to meet regularly, feel free to star 🌟 and bookmark it~Source: This article is translated from semiengineering, thank you. Intel’s foundry, TSMC, and Samsung Foundry are competing to provide all the essential components for complete 3D-ICs, which will achieve significant performance improvements with minimal power consumption in the coming years. Much … Read more