The Rising Heat of Semiconductor Packaging: Can Domestic Substitution Ignite a New Surge?
The field of semiconductor packaging continues to heat up, with advanced packaging technologies becoming a core support for cutting-edge areas such as AI and HPC. In particular, the CoWoS technology, due to its compatibility with HBM and AI chip integration requirements, is monopolized by TSMC for top-tier AI chip services globally. Domestic manufacturers are accelerating … Read more