Advanced Packaging

AI Ignites PCB Revolution: The Value of Single Server Circuit Boards Soars 7 Times, Domestic Alternatives Embrace a Trillion-Dollar Opportunity

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AI Ignites PCB Revolution: The Value of Single Server Circuit Boards Soars 7 Times, Domestic Alternatives Embrace a Trillion-Dollar Opportunity

The PCB (Printed Circuit Board) industry is experiencing explosive growth not seen in a decade, driven by the global AI computing power revolution.The traditional server PCB is valued at approximately 2000 yuan, while AI servers, due to their powerful GPU/ASIC chips, require higher layer counts (20-40 layers) and more complex technologies, causing the value of … Read more

Weekly EDA Market Update: August 18-22

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Weekly EDA Market Update: August 18-22

IntroductionIntroduction A new week of EDA dynamics is here! Mergers and acquisitions in the EDA industry are ongoing, with many companies collaborating to break through new technologies. This issue will keep you informed! Headline FocusHeadline Focus Cadence Partners with NVIDIA to Innovate Power Analysis Technology Cadence collaborates with NVIDIA to achieve significant breakthroughs in pre-silicon … Read more

SoC and Chiplet Integration

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SoC and Chiplet Integration

SoC and Chiplet Integration1. Introduction SoC integrates ICs with different functions into a single chip for a system or subsystem. The figure shows the evolution of Apple’s application processors (AP) from A10 to A14, illustrating the relationship between the number of transistors in chips of different feature sizes and the years. It is evident that … Read more

Breaking Foreign Monopoly: Semiconductor Leader Rapidly Expands Through Borrowing!

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Breaking Foreign Monopoly: Semiconductor Leader Rapidly Expands Through Borrowing!

In the first half of 2025, Changchuan Technology appeared to be thriving, with revenue soaring to 2.167 billion, a 41.8% increase; net profit grew to 427 million, nearly doubling, with a year-on-year increase of 98.73%. In the domestic semiconductor equipment sector, this growth rate is indeed impressive. For comparison, the net profit growth rate of … Read more

The Rising Heat of Semiconductor Packaging: Can Domestic Substitution Ignite a New Surge?

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The Rising Heat of Semiconductor Packaging: Can Domestic Substitution Ignite a New Surge?

The field of semiconductor packaging continues to heat up, with advanced packaging technologies becoming a core support for cutting-edge areas such as AI and HPC. In particular, the CoWoS technology, due to its compatibility with HBM and AI chip integration requirements, is monopolized by TSMC for top-tier AI chip services globally. Domestic manufacturers are accelerating … Read more

Hybrid Bonding Has Arrived! The ‘Game-Changing’ Technology Revolutionizing Chip Interconnection

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Hybrid Bonding Has Arrived! The 'Game-Changing' Technology Revolutionizing Chip Interconnection

With the increasing performance demands of chips driven by technologies such as AI, 5G, and autonomous driving, traditional packaging methods are gradually losing their advantages. An emerging technology—Hybrid Bonding—is becoming a key breakthrough in advanced packaging. It is reshaping the way chips connect, becoming the core process for high-performance computing, high-bandwidth memory (HBM), and ultra-high-layer … Read more

Integrated Circuit Column | Advanced Packaging Leading a New Era in Semiconductors: A System-Level Leap from 2D to 3D

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Integrated Circuit Column | Advanced Packaging Leading a New Era in Semiconductors: A System-Level Leap from 2D to 3D

As Moore’s Law approaches its physical limits, advanced packaging has become the core path for the semiconductor industry to break through performance bottlenecks. Emerging applications such as 5G, artificial intelligence (AI), high-performance computing (HPC), autonomous driving, and the Internet of Things (IoT) continuously elevate the demands for chip speed, bandwidth, power consumption, and system integration. … Read more

New Approaches to Chip Packaging: Advanced Packaging Becomes a Battleground for Giants, with AI as a Key Driver

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New Approaches to Chip Packaging: Advanced Packaging Becomes a Battleground for Giants, with AI as a Key Driver

Friends, let’s talk about the recent hot topic in the semiconductor circle—advanced packaging. In this era of constant innovation in the industry, it has become increasingly difficult to enhance performance solely by reducing chip size due to physical limitations. At this moment, advanced packaging technology emerges as a refreshing stream, taking center stage and becoming … Read more

Introduction to Semiconductor Packaging Processes and Equipment

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Introduction to Semiconductor Packaging Processes and Equipment

The semiconductor manufacturing process can be divided into front-end and back-end processes. The front-end process mainly involves wafer manufacturing, while the back-end process primarily focuses on packaging and testing. Among these, packaging (Package) in the back-end process refers to a series of technical methods that connect tested integrated circuit bare chips (Die) to external circuits, … Read more