Semiconductor Packaging

Qiming Star丨Tian Zhi Precision: Overcoming the Technical Barriers of Advanced Packaging C-Molding Technology to Support the Localization of Semiconductor Chips

by
Qiming Star丨Tian Zhi Precision: Overcoming the Technical Barriers of Advanced Packaging C-Molding Technology to Support the Localization of Semiconductor Chips

Tian Zhi Precision is a semiconductor equipment company empowered by Su Chuang Investment Group under the guidance of “investing in national needs and industrial needs”. The C-Molding equipment (chip compression molding) that the company focuses on is the core process equipment in the field of advanced semiconductor packaging, and its localization is a key link … Read more

Comprehensive Guide to Semiconductor Back Grinding: Equipment, Processes, and Failure Solutions for Beginners

by
Comprehensive Guide to Semiconductor Back Grinding: Equipment, Processes, and Failure Solutions for Beginners

Dear readers, the BG (Back Grinding) process in semiconductor packaging is crucial! From film application, coarse grinding, fine grinding to polishing, each step affects the wafer thickness accuracy and warpage. Beginners often struggle with wheel selection, film material compatibility, and failure troubleshooting. This comprehensive guide, compiled from official training materials, clearly breaks down grinding equipment, … Read more

Guidelines for the Design of Organic Interposer 2.5D Packaging for Embedded Bridge Chips

by
Guidelines for the Design of Organic Interposer 2.5D Packaging for Embedded Bridge Chips

This article was published in 2024 by Binghamton University, State University of New York, and Nagase Industrial Co., Ltd. Advantages of Organic Interposers (from Kimi): An organic interposer is a component used in semiconductor packaging technology that provides electrical interconnections between chips (such as CPUs or GPUs) and the package substrate. Compared to traditional silicon … Read more

Introduction to Semiconductor Packaging (7): Die Attach Process

by
Introduction to Semiconductor Packaging (7): Die Attach Process

In the previous content of this packaging series, the author briefly introduced packaging processes such as RDL, TSV, and hybrid bonding. Next, the author plans to write two more articles about semiconductor packaging processes, which will briefly introduce the die attach process and underfill process, after which we will delve into the second major part … Read more

Comprehensive Guide to Advanced Semiconductor Packaging (Part 2)

by
Comprehensive Guide to Advanced Semiconductor Packaging (Part 2)

[Image]【Table of Contents】1. Electronic Packaging Overview 2. Early Packaging Types 3. 2D: Flip Chip Packaging 4. 2D: Wafer-Level Packaging 5. The Rise of Advanced Packaging 6. 2.1D/2.3D: Ultra-Thin Organic Interposers 7. 2.5D: Silicon Interposers, Microbumps, Silicon Through-Silicon Vias, and Silicon Bridges 8. 3D-IC Packaging 9. Hybrid Bonding 2.1D/2.3D: Ultra-Thin Organic Interposers (Inte…

University Turns into Chip Factory? Fuyao Technology University Makes Waves with Bold Move

by

On November 12, Fuyao Technology University President Wang Shuguo stood on the podium, addressing hundreds of students, teachers, and parents in the audience, casually stating: “We will build a chip production line on campus by the end of the year, independently developed, with a potential output value exceeding 10 billion yuan.” This was not a … Read more

Analysis of Changdian Technology: A Leader in Semiconductor Packaging

by

As a leading enterprise in the semiconductor packaging and testing field in China, Changdian Technology’s global market position, future growth path, and core competitiveness have attracted significant market attention. This article will delve into an analysis of Changdian Technology’s market share, competitive advantages, comparisons with major competitors, and future development potential. 1. Market Position and … Read more

Introduction to Substrate Processes in Semiconductor Packaging

by
Introduction to Substrate Processes in Semiconductor Packaging

Hello, everyone. Last time we introduced the substrate in packaging, and this time we will discuss the processes involved in substrate manufacturing. After processing, the substrate mainly consists of two materials when viewed in cross-section — dielectric and metal. In terms of metal, the majority is copper, while solder joints are used for connections. In … Read more

Chip Semiconductor: Breakthrough Progress in TGV Technology

by
Chip Semiconductor: Breakthrough Progress in TGV Technology

INNOVATION Chip Semiconductor Breakthrough in TGV Technology SignificantProgress TGV Technology – Breakthrough Progress In the post-Moore era, semiconductor processes are approaching physical limits, and 2.5D/3D packaging is key to continuing Moore’s Law. The interposer layer, acting as a “bridge” for chips, plays a significant role. Traditional silicon-based interposers offer good performance but are costly (accounting … Read more

Introduction to Semiconductor Packaging Processes and Equipment

by
Introduction to Semiconductor Packaging Processes and Equipment

Follow our official account, click the top right corner of the homepage “ ··· ”, set a star mark, and stay updated with the latest news in the smart vehicle industry. The semiconductor manufacturing process can be divided into front-end and back-end processes. The front-end process mainly involves wafer manufacturing, while the back-end process primarily … Read more