Why Do Chips Need Packaging?

Why Do Chips Need Packaging?

The four main functions of semiconductor packaging are: mechanical protection, electrical connection, mechanical connection, and heat dissipation. Mechanical protection: Silicon is very fragile, similar to glass, and is easily damaged by physical and chemical factors. The primary role of semiconductor packaging is to protect the chip and devices from physical and chemical damage by sealing … Read more

In-Depth Analysis of Chip Decapsulation Technology

In-Depth Analysis of Chip Decapsulation Technology

😢🌫️ Always staring at the phone So dizzy! πŸ˜‡ Click 🎧 to listen and let’s sharpen our ears together πŸ‘‚ How to unveil the “black box” of a chip without damaging the silicon wafer? Chip decapsulation is a critical step in failure analysis, requiring precise removal of packaging materials at the micron scale while protecting … Read more

Technical Insights from Silicon Carbide Wafer Manufacturers: A Comprehensive Analysis of Hybrid Bonding

Technical Insights from Silicon Carbide Wafer Manufacturers: A Comprehensive Analysis of Hybrid Bonding

Introduction to Senhui: Suzhou Senhui Semiconductor, supported by a strong research and technical team, focuses on providing complete process solutions and wafer services for global compound semiconductor customers. The team members have deep experience in the semiconductor industry, with decades of rich capabilities in photolithography, thin film processes, epitaxy, bonding processes, as well as etching, … Read more

SOP and SOP8 Packaging Technology: Differences and Features Explained

SOP and SOP8 Packaging Technology: Differences and Features Explained

For more products and services, visit our official website:https://www.si-era.com/ In the field of semiconductor packaging, SOP (Small Outline Package) and SOP8 often cause confusion. Today, we will clearly reveal the differences and characteristics between SOP and SOP8 through a Q&A format. If we often meet, click above to follow us and set us as a … Read more