On February 6, 1959, a four-page application containing images and five pages of text was officially submitted to the United States Patent Office. This was Texas Instruments’ (TI) patent application for the concept of monolithic integration, which is the first patent for what we now know as the ubiquitous Integrated Circuit (IC). As the inventor, … Read more
Today, we continue to introduce the basics of the plating process in PCB/HDI manufacturing, following Part 2; this is Part 3. First, let’s introduce a few typical blind hole structures: The above case is a 2-layer HDI board with 8 layers, where layers L3-L6 are designed with buried holes, and layers L1/L2, L2/L3 and L6/L7, … Read more
1. The Birth and Evolution of PCBs Prototype Stage (1903–1940) In 1903, German engineer Albert Hanson created “circuits” by sandwiching metal foil between wax paper in telephone switchboards, considered the earliest concept of “inter-layer interconnection.” In 1925, Frenchman Charles Ducas used templates to print conductive ink, proposing the concept of “printed wiring” for the first … Read more
01 Introduction This article is a translation of the article with the same name published by the “Electronic Chief Intelligence Officer” editorial team of “Printed Circuit Board Information”. The full text is as follows. To meet the demands of the new generation of high I/O semiconductor packaging, significant changes have occurred in the manufacturing processes … Read more
With the increasing performance demands of chips driven by technologies such as AI, 5G, and autonomous driving, traditional packaging methods are gradually losing their advantages. An emerging technology—Hybrid Bonding—is becoming a key breakthrough in advanced packaging. It is reshaping the way chips connect, becoming the core process for high-performance computing, high-bandwidth memory (HBM), and ultra-high-layer … Read more
