The rapid development of artificial intelligence is driving a sharp increase in the demand for the entire printed circuit board (PCB) material chain, with significant rises in both price and output. According to the “Electronic Times Asia,” supply pressures are no longer limited to low thermal expansion coefficient (CTE) glass fiber fabrics used for CoWoS … Read more
AI ASIC Tracking – September 5, 2025 2026 ASIC Shipment Volume and Value Forecast Google TPU 2026 Forecast Continues to be Revised Upwards Within just three months, the upstream CoWoS “guaranteed capacity” has been revised from 1.2M → 1.5M → 1.8M → 2.0M units, and is currently negotiating towards 2.7-2.8M units, which is a 50% … Read more
1 Core Insights Market Overview In the past week (August 4-8), the SW Electronics Index rose by 1.65%, outperforming the CSI 300 Index by 0.42 percentage points. Among the six major sub-sectors, the performance of consumer electronics, other electronics II, electronic chemicals II, optical optoelectronics, semiconductors, and components were 4.27%, 4.06%, 2.70%, 1.51%, 1.45%, and … Read more
Friends, let’s talk about the recent hot topic in the semiconductor circle—advanced packaging. In this era of constant innovation in the industry, it has become increasingly difficult to enhance performance solely by reducing chip size due to physical limitations. At this moment, advanced packaging technology emerges as a refreshing stream, taking center stage and becoming … Read more
Author | Du Wenjing, Chang Liang The AIGC led by large models marks the starting point of the Fourth Industrial Revolution, possessing the ability to fundamentally change the rules across various industries. The year 2023 has become the inaugural year for AI large models, with significant improvements in pre-training and generative capabilities, as well as … Read more
On April 2, GUC Creative Electronics, a Taiwanese chip service company with over one-third ownership by TSMC, announced the successful tape-out of the world’s first HBM4 IP (including controller and PHY physical layer) using TSMC’s advanced N3P process and CoWoS-R advanced packaging. GUC’s HBM4 IP supports data transfer rates of up to 12Gbps. Compared to … Read more