CoWoS

US Chip Sanctions Escalate, Advanced Packaging Becomes the Next Strategic Pivot for Domestic AI Chips

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US Chip Sanctions Escalate, Advanced Packaging Becomes the Next Strategic Pivot for Domestic AI Chips

Author | Du Wenjing, Chang Liang The AIGC led by large models marks the starting point of the Fourth Industrial Revolution, possessing the ability to fundamentally change the rules across various industries. The year 2023 has become the inaugural year for AI large models, with significant improvements in pre-training and generative capabilities, as well as … Read more

GUC Creative Electronics Announces Successful Tape-Out of the World’s First HBM4 IP

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GUC Creative Electronics Announces Successful Tape-Out of the World's First HBM4 IP

On April 2, GUC Creative Electronics, a Taiwanese chip service company with over one-third ownership by TSMC, announced the successful tape-out of the world’s first HBM4 IP (including controller and PHY physical layer) using TSMC’s advanced N3P process and CoWoS-R advanced packaging. GUC’s HBM4 IP supports data transfer rates of up to 12Gbps. Compared to … Read more