[Image]【Table of Contents】1. Electronic Packaging Overview 2. Early Packaging Types 3. 2D: Flip Chip Packaging 4. 2D: Wafer-Level Packaging 5. The Rise of Advanced Packaging 6. 2.1D/2.3D: Ultra-Thin Organic Interposers 7. 2.5D: Silicon Interposers, Microbumps, Silicon Through-Silicon Vias, and Silicon Bridges 8. 3D-IC Packaging 9. Hybrid Bonding 2.1D/2.3D: Ultra-Thin Organic Interposers (Inte…
Former SK Hynix employee Mr. Jin was sentenced to imprisonment for leaking CIS (CMOS Image Sensor, a semiconductor device that converts light into digital signals) technology. On October 31, Mr. Jin was sentenced to 1 year and 6 months in prison for violating the Unfair Competition Prevention and Trade Secret Protection Act (leaking trade secrets … Read more
1. Qualcomm’s collaboration verification schedule: The project was officially initiated in the first quarter of this year, completing domestic supplier verification. It is expected that after the chip returns at the end of June, packaging, testing, yield, and functionality evaluations will be conducted, with samples sent to mobile manufacturers in February to March next year, … Read more
With the increasing performance demands of chips driven by technologies such as AI, 5G, and autonomous driving, traditional packaging methods are gradually losing their advantages. An emerging technology—Hybrid Bonding—is becoming a key breakthrough in advanced packaging. It is reshaping the way chips connect, becoming the core process for high-performance computing, high-bandwidth memory (HBM), and ultra-high-layer … Read more
Chip packaging is a critical step in semiconductor manufacturing, providing physical protection, electrical interconnection, and heat dissipation for chips. Bonding technology is the method of connecting bare chips to external materials. Currently, there are four main bonding technologies: the traditional and reliable Wire Bonding, the high-performance Flip Chip Bonding, the highly automated Tape Automated Bonding … Read more
Introduction to Senhui: Suzhou Senhui Semiconductor, supported by a strong research and technical team, focuses on providing complete process solutions and wafer services for global compound semiconductor customers. The team members have deep experience in the semiconductor industry, with decades of rich capabilities in photolithography, thin film processes, epitaxy, bonding processes, as well as etching, … Read more