Four Bonding Methods in Chip Packaging

Four Bonding Methods in Chip Packaging

Chip packaging is a critical step in semiconductor manufacturing, providing physical protection, electrical interconnection, and heat dissipation for chips. Bonding technology is the method of connecting bare chips to external materials. Currently, there are four main bonding technologies: the traditional and reliable Wire Bonding, the high-performance Flip Chip Bonding, the highly automated Tape Automated Bonding … Read more

Technical Insights from Silicon Carbide Wafer Manufacturers: A Comprehensive Analysis of Hybrid Bonding

Technical Insights from Silicon Carbide Wafer Manufacturers: A Comprehensive Analysis of Hybrid Bonding

Introduction to Senhui: Suzhou Senhui Semiconductor, supported by a strong research and technical team, focuses on providing complete process solutions and wafer services for global compound semiconductor customers. The team members have deep experience in the semiconductor industry, with decades of rich capabilities in photolithography, thin film processes, epitaxy, bonding processes, as well as etching, … Read more