US Chip Sanctions Escalate, Advanced Packaging Becomes the Next Strategic Pivot for Domestic AI Chips

US Chip Sanctions Escalate, Advanced Packaging Becomes the Next Strategic Pivot for Domestic AI Chips

Author | Du Wenjing, Chang Liang The AIGC led by large models marks the starting point of the Fourth Industrial Revolution, possessing the ability to fundamentally change the rules across various industries. The year 2023 has become the inaugural year for AI large models, with significant improvements in pre-training and generative capabilities, as well as … Read more

Why Advanced Packaging Has Become a Battleground for Smartphone Manufacturers

Why Advanced Packaging Has Become a Battleground for Smartphone Manufacturers

Recently, the “thick chip” featured in the teardown video of Huawei’s foldable flagship Pura X has sparked heated discussions. Although Apple’s M-series processors have long adopted similar packaging technologies, Huawei’s move has ignited a wave of industry discussions. This phenomenon reflects a silent “packaging revolution” in the smartphone chip sector—manufacturers are no longer just competing … Read more