System-in-Package (SiP) is an advanced integrated circuit packaging technology. Its core idea is to integrate multiple semiconductor chips (Die) with different functions and passive components (such as resistors, capacitors, inductors, filters, antennas, etc.) within the same package shell, thereby forming a complete or nearly complete system or subsystem. In simple terms, SiP achieves system integration … Read more
SoC and Chiplet Integration1. Introduction SoC integrates ICs with different functions into a single chip for a system or subsystem. The figure shows the evolution of Apple’s application processors (AP) from A10 to A14, illustrating the relationship between the number of transistors in chips of different feature sizes and the years. It is evident that … Read more
As Moore’s Law approaches its physical limits, advanced packaging has become the core path for the semiconductor industry to break through performance bottlenecks. Emerging applications such as 5G, artificial intelligence (AI), high-performance computing (HPC), autonomous driving, and the Internet of Things (IoT) continuously elevate the demands for chip speed, bandwidth, power consumption, and system integration. … Read more
Follow us for more exciting discoveries! â–ŒThis article is from Semiconductor Industry Observation Abstract: Integrating multiple heterogeneous chiplets into a package is a promising and cost-effective strategy that can build flexible and scalable systems while effectively accelerating diverse workloads. Based on this, we propose Arvon, which integrates a 14nm FPGA chiplet and two closely packed … Read more
Author | Du Wenjing, Chang Liang The AIGC led by large models marks the starting point of the Fourth Industrial Revolution, possessing the ability to fundamentally change the rules across various industries. The year 2023 has become the inaugural year for AI large models, with significant improvements in pre-training and generative capabilities, as well as … Read more
Recently, the “thick chip” featured in the teardown video of Huawei’s foldable flagship Pura X has sparked heated discussions. Although Apple’s M-series processors have long adopted similar packaging technologies, Huawei’s move has ignited a wave of industry discussions. This phenomenon reflects a silent “packaging revolution” in the smartphone chip sector—manufacturers are no longer just competing … Read more