Why Advanced Packaging Has Become a Battleground for Smartphone Manufacturers
Recently, the “thick chip” featured in the teardown video of Huawei’s foldable flagship Pura X has sparked heated discussions. Although Apple’s M-series processors have long adopted similar packaging technologies, Huawei’s move has ignited a wave of industry discussions. This phenomenon reflects a silent “packaging revolution” in the smartphone chip sector—manufacturers are no longer just competing … Read more