The field of semiconductor packaging continues to heat up, with advanced packaging technologies becoming a core support for cutting-edge areas such as AI and HPC. In particular, the CoWoS technology, due to its compatibility with HBM and AI chip integration requirements, is monopolized by TSMC for top-tier AI chip services globally. Domestic manufacturers are accelerating their catch-up efforts: Shenghe Jingwei and Tongfu Microelectronics are advancing CoWoS-like technologies and expanding production capacity, with Shenghe Jingwei already achieving mass production of 2.5D chiplets. Companies like Plaxion Intelligent and Huazhuo Precision have made breakthroughs in packaging equipment, breaking through some technical barriers. Changjiang Electronics Technology and other companies have entered the global top ten in packaging and testing, with the advanced packaging market expected to exceed 110 billion yuan by 2025. However, domestic substitution still faces challenges, as there is a gap in advanced process technology and materials compared to international leading levels, and subsequent breakthroughs will require ongoing technical efforts.