ABC Sharing Session No. 96Sharing Topic: Analysis of PCBA Process StepsSharing Time: 2020.10.14 Speaker: ABC Xiao VRecorder: ABCTinaEditor: Xiao GangTotal Word Count: 5626 words / Reading Time 6 minutesThis is the first session of the ABC electronic product cost analysis series:1. Analysis of PCBA Process Steps (This Sharing)2. Analysis of PCBA Processing Cost Factors3. Classification … Read more
[PCB Information Network] FPC, also known as Flexible Printed Circuit, has a significantly different PCBA assembly and soldering process compared to rigid circuit boards. Due to the insufficient hardness and flexibility of FPC boards, without using dedicated carriers, it is impossible to complete basic SMT processes such as fixing, transmission, printing, and placement. 1. Pre-treatment … Read more
SMT Top Networking Circle A professional circle for sharing networking resources and achieving career advancement. New Platform 2020 1. FPC Preprocessing FPC boards are relatively soft and are generally not vacuum packaged when leaving the factory. They are prone to absorb moisture from the air during transportation and storage, so they need to undergo a … Read more
Warm reminder: For friends who like the SMT Top Networking Circle public account, please note! According to the new regulations for public account push notifications, please set the SMT Top Networking Circle public account as “Starred” or “PinnedTop“, so that you can receive the valuable content we share every day! 2020 New Platform PCBA Circuit … Read more
SMT, short for Surface Mount Technology, originated in the 1960s, involves directly mounting SMD components onto PCBs. Its greatest advantage is the high wiring density per unit area of each component, which shortens connection lines and improves electrical performance. Below, I will quickly guide you through the SMT process flow. (This is SMT) 01 SMT … Read more
The design differences of contact points have varying impacts on contact quality and reliability, accessibility, and subsequent solderability, which are negligible for small contact points. 1. Component Testing As the BGA pitch and solder ball size decrease, the design of socket manufacturers faces increasing challenges to adequately test BGA packages. Socket manufacturers are focusing on … Read more
Tombstone defects on PCBs, also known as the Manhattan Bridge or bridge effect, are a type of assembly defect for surface-mounted (passive) components. This defect occurs due to inconsistent melting times of solder paste at both ends of the component, leading to uneven stress on the component. Given that these components are relatively light, they … Read more
1. Concept of PCB PCB (Printed Circuit Board), known in Chinese as 印制电路板, is an important electronic component that serves as a support for electronic components and provides electrical connections between them. It is called a “printed” circuit board because it is made using electronic printing technology. 2. Role and Function of PCB in Various … Read more
SMT Top Networking Circle A professional circle for sharing networking resources and achieving career advancement. New Platform 2020 1. Purpose The total cost of a product is determined by 60% from the initial design; 75% of manufacturing costs depend on design specifications and guidelines; and 70-80% of production defects are caused by design issues. Therefore, … Read more
Real-time Temperature Monitoring Intelligent System – PIS As the world's largest electronic manufacturing base, looking back over the 40 years of reform and opening up, we can clearly distinguish the evolution of the domestic electronic manufacturing industry from nothing to something, from small to large, from ordinary to specialized, transitioning from labor-intensive to technology-intensive, and … Read more