TOP Mounting Target On Paste Due to the ultra-thin and flexible characteristics of FPC (Flexible Printed Circuits), it is widely used in the sliding and bending parts of small electronic devices, as well as in the three-dimensional layout of small mobile terminals like smartphones and wearable devices. However, despite the widespread application of flexible circuit … Read more
For more exciting content, please click👆SMT Home👇Follow me,Set as ★Star Mark★ Cited Standards No. Document No. Document Title 1 IPC-7525 Stencil Design Guidelines 2 IPC-7527 Solder Paste Printing Requirements 3 IPC/EIA J-STD-004 Flux Requirements 4 IPC/EIA J-STD-005 Solder Paste Requirements 5 IPC-A-600 Acceptability of Printed Boards 6 IPC-A-610 Acceptability of Electronic Components 7 IPC-7711/21 Rework … Read more
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SPI (Solder Paste Inspection) refers to the solder paste inspection system, whose main function is to detect the quality of solder paste printing, including volume, area, height, XY offset, shape, bridging, etc. To quickly and accurately detect extremely small solder paste, detection principles generally use PMP (Phase Modulation Profile Measurement Technology) and Laser (Laser Triangulation … Read more