Solder Paste Inspection

PCBA Manufacturing Process Specification: SPI Solder Paste Inspection

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PCBA Manufacturing Process Specification: SPI Solder Paste Inspection

For more exciting content, please click👆SMT Home👇Follow me,Set as ★Star Mark★ Cited Standards No. Document No. Document Title 1 IPC-7525 Stencil Design Guidelines 2 IPC-7527 Solder Paste Printing Requirements 3 IPC/EIA J-STD-004 Flux Requirements 4 IPC/EIA J-STD-005 Solder Paste Requirements 5 IPC-A-600 Acceptability of Printed Boards 6 IPC-A-610 Acceptability of Electronic Components 7 IPC-7711/21 Rework … Read more

SPI Parameter Setting Standards and SMT Solder Paste Usage Algorithm

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SPI Parameter Setting Standards and SMT Solder Paste Usage Algorithm

For more exciting content, please click👇SMT Home👇Follow me,set as ★Star★ Parameter setting reference: “IPC-7527 Solder Paste Printing Requirements” Advertising space recruitment: Recruitment phone:150 9990 5300 Recruitment WeChat: SMTDFM Disseminate true knowledge, empower intelligent manufacturing; If it helps, I am honored! END â–¼ Click the card below to discover more wonderful articles You“Are you watching”?

Principles and Detection Methods of 3D SPI

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Principles and Detection Methods of 3D SPI

SPI (Solder Paste Inspection) refers to the solder paste inspection system, whose main function is to detect the quality of solder paste printing, including volume, area, height, XY offset, shape, bridging, etc. To quickly and accurately detect extremely small solder paste, detection principles generally use PMP (Phase Modulation Profile Measurement Technology) and Laser (Laser Triangulation … Read more