How can traditional printing processes break through physical limits under the stringent requirement of a solder paste thickness deviation of only ±15μm? The modern SPI (Solder Paste Inspection) closed-loop system reduces the defect rate from traditional manual sampling of 3500ppm to below 50ppm through 3D laser scanning and real-time feedback control, becoming the first line … Read more
Tombstone defects on PCBs, also known as the Manhattan Bridge or bridge effect, are a type of assembly defect for surface-mounted (passive) components. This defect occurs due to inconsistent melting times of solder paste at both ends of the component, leading to uneven stress on the component. Given that these components are relatively light, they … Read more
Click the blue text to follow us In the SMT processing, solder paste printing is a crucial step that affects soldering quality. SPI (Solder Paste Inspection) serves as the core tool for solder paste quality inspection, playing a vital role in ensuring the quality of solder paste printing and improving the consistency and reliability of … Read more
In modern electronics manufacturing, Surface Mount Technology (SMT) plays a crucial role. The SPI (Solder Paste Inspection) at the second SMT station is an important inspection process in the SMT production line, which is essential for ensuring product quality, improving production efficiency, and reducing production costs. One day, on the SMT production line, the SPI … Read more
TOP Mounting Target On Paste Due to the ultra-thin and flexible characteristics of FPC (Flexible Printed Circuits), it is widely used in the sliding and bending parts of small electronic devices, as well as in the three-dimensional layout of small mobile terminals like smartphones and wearable devices. However, despite the widespread application of flexible circuit … Read more
For more exciting content, please click👆SMT Home👇Follow me,Set as ★Star Mark★ Cited Standards No. Document No. Document Title 1 IPC-7525 Stencil Design Guidelines 2 IPC-7527 Solder Paste Printing Requirements 3 IPC/EIA J-STD-004 Flux Requirements 4 IPC/EIA J-STD-005 Solder Paste Requirements 5 IPC-A-600 Acceptability of Printed Boards 6 IPC-A-610 Acceptability of Electronic Components 7 IPC-7711/21 Rework … Read more
For more exciting content, please click👇SMT Home👇Follow me,set as ★Star★ Parameter setting reference: “IPC-7527 Solder Paste Printing Requirements” Advertising space recruitment: Recruitment phone:150 9990 5300 Recruitment WeChat: SMTDFM Disseminate true knowledge, empower intelligent manufacturing; If it helps, I am honored! END ▼ Click the card below to discover more wonderful articles You“Are you watching”?
SPI (Solder Paste Inspection) refers to the solder paste inspection system, whose main function is to detect the quality of solder paste printing, including volume, area, height, XY offset, shape, bridging, etc. To quickly and accurately detect extremely small solder paste, detection principles generally use PMP (Phase Modulation Profile Measurement Technology) and Laser (Laser Triangulation … Read more