Q&A | How Texas Instruments Contributes to a Sustainable Future

Q&A | How Texas Instruments Contributes to a Sustainable Future

Click the blue text above Follow us! For decades, Texas Instruments has been committed to reducing its environmental impact, setting goals such as improving production efficiency and reducing greenhouse gas emissions, and achieving them one by one. These actions have yielded significant results. Texas Instruments’ “2022 Corporate Citizenship Report” shows that since 2015, we have … Read more

Integrated Circuit Column | Advanced Packaging Leading a New Era in Semiconductors: A System-Level Leap from 2D to 3D

Integrated Circuit Column | Advanced Packaging Leading a New Era in Semiconductors: A System-Level Leap from 2D to 3D

As Moore’s Law approaches its physical limits, advanced packaging has become the core path for the semiconductor industry to break through performance bottlenecks. Emerging applications such as 5G, artificial intelligence (AI), high-performance computing (HPC), autonomous driving, and the Internet of Things (IoT) continuously elevate the demands for chip speed, bandwidth, power consumption, and system integration. … Read more

Breakthrough Achievement: Successful Tape-Out of 8-Inch High-Performance Trench Gate SiC MOSFET Chip with Independent Intellectual Property Rights!

Breakthrough Achievement: Successful Tape-Out of 8-Inch High-Performance Trench Gate SiC MOSFET Chip with Independent Intellectual Property Rights!

Shenzhen Pinghu Laboratory, in collaboration withShenzhen Pengjin High-Tech Co., Ltd., has made asignificantbreakthrough in the field ofdomesticwide bandgap semiconductor power devices! Successfully overcomingthe core technical challenges of the 1200V trench gate SiC MOSFET chip, a8-inch process platform has been established,achievinghigh-performance1200Vtrench gateSiCMOSFET chip tape-out success.Itscore invention patent(Patent Publication No.:CN118610269A) has been authorized.This marks a new level … Read more

Understanding the ‘Biological Chip’ in the Digital World (Part 3): What Are We Building? | Atantares Technology’s DNA Storage Products and Roadmap

Understanding the 'Biological Chip' in the Digital World (Part 3): What Are We Building? | Atantares Technology's DNA Storage Products and Roadmap

Atantares Medical Technology Co., Ltd. Atantares The Digital World “Biological Chip” (Part 3) Published on: 2025/07/11 What Are We Building? — DNA Storage Products of Atantares Technology and Roadmap Total Word Count: 2835 words Estimated Reading Time: 9 minutes In the previous two articles, we reviewed the necessity of DNA storage as the next-generation information … Read more

New Approaches to Chip Packaging: Advanced Packaging Becomes a Battleground for Giants, with AI as a Key Driver

New Approaches to Chip Packaging: Advanced Packaging Becomes a Battleground for Giants, with AI as a Key Driver

Friends, let’s talk about the recent hot topic in the semiconductor circle—advanced packaging. In this era of constant innovation in the industry, it has become increasingly difficult to enhance performance solely by reducing chip size due to physical limitations. At this moment, advanced packaging technology emerges as a refreshing stream, taking center stage and becoming … Read more

Semiconductor Optical Amplifiers (SOA): From Substitute to Core of Optical Communication

Semiconductor Optical Amplifiers (SOA): From Substitute to Core of Optical Communication

Click the blue text to follow us Semiconductor Optical Amplifier SOA The Journey from Substitute to Core of Optical Communication A weak light signal passes through a chip only a few millimeters in size, and its energy increases a hundredfold upon output—this is the “signal booster” that is quietly yet indispensably enhancing modern optical communication … Read more

In-Depth Article: Detailed Explanation of the Chip Manufacturing Process!

“IT Chat” is a professional IT information and service platform under the Machinery Industry Press, dedicated to helping readers master more professional and practical knowledge and skills in the broad field of IT, quickly enhancing their workplace competitiveness. Click the blue WeChat name to quickly follow us. This article is reprinted from: Fresh Date Classroom … Read more

Semiconductor Special: Semiconductor Equipment

Semiconductor Special: Semiconductor Equipment

Article Outline Wafer Manufacturing Equipment Packaging Equipment Testing Equipment Wafer manufacturing equipment, packaging equipment, and testing equipment are important components of the semiconductor equipment industry. Below, we will provide a detailed introduction to these three types of semiconductor equipment. 1. Wafer Manufacturing Equipment 1.1 Types of Wafer Manufacturing Equipment Wafer manufacturing equipment is one of … Read more

Democratizing 3D Integration: A Low-Cost Prototyping Solution Based on Chip-Level Thinning, Through-Silicon Vias (TSV), and Meta Bonding

Democratizing 3D Integration: A Low-Cost Prototyping Solution Based on Chip-Level Thinning, Through-Silicon Vias (TSV), and Meta Bonding

Original link: https://xplorestaging.ieee.org/document/11007580【Abstract】 Three-dimensional integrated circuit (3D-IC) technology, with its vertical interconnections through silicon vias (TSV), has become central to advanced semiconductor devices. However, the initial development costs are prohibitively high, primarily due to the substantial investment required for wafer-level TSV processes. This study proposes…

New Forces in the Rankings: Pure Semiconductor – Building a Domestic Silicon Carbide Symbiotic Network

New Forces in the Rankings: Pure Semiconductor - Building a Domestic Silicon Carbide Symbiotic Network

This is a testament to the glory of the city, a historical epic that stirs the industrial landscape. Since its emergence in 2005, the “Ningbo Entrepreneurship and Innovation Ranking” has measured the industrial leap along the East China Sea over twenty years, inscribing the legend of entrepreneurship and innovation in Ningbo, continuously projecting the strong … Read more