👆If you wish to meet regularly, feel free to star 🌟 and bookmark it~ The global chip industry may be on the brink of a revolutionary breakthrough! The research group led by Feng Jicheng at ShanghaiTech University (AIL) has successfully developed the world’s first “chip nano vessel 3D printer,” overcoming the processing bottleneck of next-generation … Read more
Author | Du Wenjing, Chang Liang The AIGC led by large models marks the starting point of the Fourth Industrial Revolution, possessing the ability to fundamentally change the rules across various industries. The year 2023 has become the inaugural year for AI large models, with significant improvements in pre-training and generative capabilities, as well as … Read more
On April 22, the front page of the Shaoxing Daily reported: “Qili Semiconductor’s Advanced Packaging Technology Leads in China: Building Chips Like LEGO”. The full text is as follows ↓↓↓ Like stacking LEGO blocks, different specifications and characteristics of small chips are stacked together and packaged to form a complete chip, achieving characteristics such as … Read more
A silent technological war On April 3, 2025, a ban from the Japanese government shook the global semiconductor industry—export controls on EUV (Extreme Ultraviolet) photoresists to China. This seemingly ordinary chemical material actually chokes the throat of China’s 3-nanometer chip manufacturing. As I pored over the financial reports of Japan’s JSR Corporation late at night, … Read more
Chip project team founding team recruitment! ◀ Click to view! In the adoption of new elements in semiconductors, TSMC has been a pioneer for many years and often leads the trend. However, the company now seems to be abandoning the use of high numerical aperture (NA) EUV lithography equipment in its A14 process, opting instead … Read more
Source: Fresh Date Classroom Original Author: Little Date Jun This article mainly introduces the process of chip manufacturing. Oxidation First, on the wafers that have been cut and polished, we need to perform an oxidation step. The purpose of oxidation is to form a protective film (oxide layer) on the fragile surface of the wafer. … Read more
In the previous issue, we introduced the wafer preparation process (link). Silicon ingots and wafers Today, we will continue discussing the manufacturing process of chips (die). This stage is the most challenging part of the chip manufacturing process. I will try to explain it in a simple and understandable way, and I hope everyone can … Read more
1. Introduction In the semiconductor industry, every breakthrough in process technology is akin to a technological revolution, redefining the boundaries of chip performance and injecting powerful vitality into the fields of intelligent electronic devices and high-performance computing. On April 24, 2025, TSMC officially announced at the 2025 Technology Symposium in the United States that its … Read more
Yangzhou Lattice Semiconductor specializes in providing high-purity, large-size single crystal silicon & polycrystalline silicon materials, and can perform deep processing customization such as cutting, grinding, polishing, and drilling, including silicon wafers, silicon components, silicon target materials, silicon seed crystals, silicon electrodes, silicon rings, silicon window pieces, and other silicon products. The etching technique is a … Read more
This article is compiled by Semiconductor Industry Insight (ID: ICVIEW) from semiengineering.As design complexity increases, manual design methods struggle to minimize wire lengths.In System on Chip (SoC) design, wire length refers to the total physical distance of interconnections within the Network on Chip (NoC). It is a critical parameter affecting performance, power consumption, and manufacturing … Read more