China is accelerating the establishment of its artificial intelligence chip ecosystem as U.S. restrictions take effect. Here is the current status of its supply chain: Key Points U.S.-led export controls have excluded China from key segments of the AI chip supply chain. Many chip experts say this has had a dual effect: on one hand, … Read more
Infrared detection technology and autonomous driving vision systems are core areas of modern information perception, facing long-standing performance bottlenecks in fundamental devices. In the field of infrared detection, the challenge of balancing dark current suppression and room temperature operation limits the sensitivity and practical application of detectors. In the autonomous driving sector, issues such as … Read more
To fully leverage the potential of quantum computing, error correction must be completed before errors occur. With enhanced connectivity between quantum bits, the redundancy and error rate requirements for achieving fault-tolerant quantum computing can be relatively reduced. Even so, the required redundancy will quickly push the number of quantum bits into the millions. Considering the … Read more
Abbreviations Used in This Article (1) DFB：Distributed Feedback Laser(分布式反馈激光器)。It provides feedback through an integrated Bragg grating (a periodically modulated refractive index structure), achieving single longitudinal mode laser output with narrow linewidth and high wavelength stability, widely used in optical communication and sensing fields. (2) DBR：Distributed Bragg Reflector Laser(分布式布拉格反射器激光器)。Similar to DFB but with a different structure, … Read more
The chip packaging testing phase aims to process wafers that meet quality standards through precise cutting, wire bonding, and encapsulation processes to ensure electrical connections between the chip’s internal circuits and external devices, providing necessary mechanical and physical protection for the chip. Testing tools are used to conduct comprehensive and rigorous functional and performance testing … Read more
Recently, it was officially announced that Xiaomi’s self-developed mobile SoC chip has been named “Xuanjie O1” and will be released in late May. This sudden emergence of a self-developed chip has surprised many, and Lei Jun specifically emphasized that this chip is designed and developed independently by Xiaomi. Xiaomi has done an excellent job of … Read more
Today, let’s dive into some hardcore content! 🔥 With the help of this chip fabrication cost evolution chart, we will understand how chip manufacturing has been “spending money like water” from 90nm to 5nm. Whether you are a newly minted electronic engineer or a chip investment analysis enthusiast, after reading this, you will confidently say: … Read more
Click the blue text to follow us Scattering the eagle spirits, soaring across the land, With wisdom and courage, calling for the wisdom of China. —— “The State Council’s Tribute to Comrade Jiang Shangzhou” 01 Introduction Yang Rui, former host of the English channel of China Central Television, interviewed Dutch journalist and semiconductor observer Mark … Read more
【PCB Information Network】According to reports from South Korean media ET News, there are rumors in the industry that Apple will launch its new smartphone, the iPhone 7 (tentative name), in the fall of 2016, which will feature chips using FOWLP packaging technology, making the new iPhone lighter and reducing manufacturing costs. Previously, Apple decided to … Read more
In the previous issue, we introduced the wafer preparation process (link). Silicon ingots and wafers Today, we will continue to discuss the manufacturing process of chips (die). This stage is the most challenging part of the chip manufacturing process. I will try to explain it in a simple and understandable way, and I hope everyone … Read more