Hello, everyone. Last time we introduced the substrate in packaging, and this time we will discuss the processes involved in substrate manufacturing. After processing, the substrate mainly consists of two materials when viewed in cross-section — dielectric and metal. In terms of metal, the majority is copper, while solder joints are used for connections. In … Read more
Banner | Promotion Ferroelectricity is a spontaneous polarization state exhibited by dielectrics, commonly found in materials with lower symmetry. Fluids or highly mobile soft materials typically exhibit high symmetry, thus conflicting with the requirements for ferroelectricity. Introducing strong polarity or ferroelectricity is a focus in the field of new liquid crystal materials, which is significant … Read more
Article Source: SiP and Advanced Packaging Technology Original Author: Suny Li Rigid-Flex circuits have three basic characteristics: Multi-bending, Multi-stackup, and Multi-zone. Additionally, material selection is also an important aspect of Rigid-Flex design. Multi-stackup design refers to using different stacking structures in different areas of the substrate, with varying layer counts and thicknesses. So, how do … Read more
👆If you wish to meet often, Welcome to star 🌟 and collect it~ High-frequency communication has driven the development of dielectric materials, which need to have minimal signal delay or loss, as well as high power and long-term stability under extreme conditions. Although polyimide (PI) has many advantages, its dielectric constant (3.1-3.8) and dielectric loss … Read more