automotive thermal management

Semiconductor Series Research (10) RF Systems – Third Generation Semiconductor GaN RF Chips (C03: Gallium Nitride RF Systems and Devices)

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Semiconductor Series Research (10) RF Systems - Third Generation Semiconductor GaN RF Chips (C03: Gallium Nitride RF Systems and Devices)

This chapter introduces some technologies that design Gallium Nitride (GaN) for power amplifiers (PAs) and other applications, describing how GaN is widely used in RF (Radio Frequency) front ends. We also explore how technology leaders provide discrete, monolithic microwave integrated circuits (MMICs), and highly integrated modules to accommodate multiple application areas. Additionally, we explain the … Read more

Funnel Holes on PCBs: The Unassuming Small Holes

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Funnel Holes on PCBs: The Unassuming Small Holes

In the world of PCB (Printed Circuit Board) design, vias, blind holes, and buried holes are familiar “standard operations”. However, many newcomers to circuit design may have never heard of “funnel holes”—these uniquely shaped holes are not arbitrary but are functional designs created to solve specific engineering challenges. 1 What are Funnel Holes? A funnel … Read more

Introduction to Semiconductor Packaging (7): Die Attach Process

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Introduction to Semiconductor Packaging (7): Die Attach Process

In the previous content of this packaging series, the author briefly introduced packaging processes such as RDL, TSV, and hybrid bonding. Next, the author plans to write two more articles about semiconductor packaging processes, which will briefly introduce the die attach process and underfill process, after which we will delve into the second major part … Read more

In-Depth Study of Investment Opportunities and Technical Architecture for Space Artificial Intelligence Hardware

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In-Depth Study of Investment Opportunities and Technical Architecture for Space Artificial Intelligence Hardware

1. The Great Migration of Computing Power At the intersection of artificial intelligence (AI) and aerospace engineering, a profound paradigm shift is occurring. Elon Musk, CEO of SpaceX, recently made a bold assertion that within five years, AI computing power in space will surpass that on Earth, and the weight of space AI hardware could … Read more

The Universe Between Millimeters: GMC Builds a ‘Quantum Wall’ for Chips

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The Universe Between Millimeters: GMC Builds a 'Quantum Wall' for Chips

Click the blue text above to follow us In the dim light of the chip packaging workshop, a particle with a diameter of only 0.1 millimeters is gently lifted by a vacuum nozzle, like a droplet of morning dew frozen in time. It appears ordinary, yet within the next 0.8 seconds, it undergoes 180°C melting, … Read more

Research on High-Integration PCB Embedded Packaging Technology for Power Modules in Electric Vehicle Main Drive Inverters

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Research on High-Integration PCB Embedded Packaging Technology for Power Modules in Electric Vehicle Main Drive Inverters

In recent years, with the rapid development of the new energy vehicle industry, the three electric systems related to new energy vehicles—batteries, electric drives, and electronic control systems—are continuously being upgraded. To improve the range of new energy vehicles, the three electric systems are constantly being updated, especially with the main goal of increasing the … Read more

Custom Thermal Solutions for Semiconductor Etching Machines – Ultra-Low Volatile Thermal Conductive Silicone Sheet XK-P30

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Custom Thermal Solutions for Semiconductor Etching Machines - Ultra-Low Volatile Thermal Conductive Silicone Sheet XK-P30

1. 5.0W Thermal Conductivity + 10kV/mm Insulation: The dual insurance solution for the motor winding group addresses the three major challenges of humanoid robot motors: high power density, high-frequency vibration, and confined spaces. The Jinling Tongda thermal conductive silicone sheet XK-P50 achieves a breakthrough in performance. • Efficient Heat Transfer: The thermal conductive silicone sheet … Read more

Shaping the Future of Chips: Innovations in Semiconductor Manufacturing with 3M Material Science

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Shaping the Future of Chips: Innovations in Semiconductor Manufacturing with 3M Material Science

Click on the “Semiconductor New Materials Industry” at the top to find like-minded individuals on the industry journey From smartphones to data centers, semiconductors are at the core of modern life. Today, with the exponential growth of artificial intelligence applications, high-performance computing and advanced storage are driving a new wave of demand for semiconductor chips—while … Read more

A Complete PCB Design Process and Key Points: No More Mistakes!

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A Complete PCB Design Process and Key Points: No More Mistakes!

Data Input Stage 1. Check if the received data in the process is complete (including: schematic, *.brd file, bill of materials, PCB design specifications, and PCB design or modification requirements, standardization requirements, process design specification documents). 2. Confirm that the PCB template is the latest version. 3. Verify that the positioning of components in the … Read more

Harnessing Electromagnetic Waves: How RF PCB Design Transitions from ‘Empirical Art’ to ‘Precision Science’

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Harnessing Electromagnetic Waves: How RF PCB Design Transitions from 'Empirical Art' to 'Precision Science'

In the rapid development of 5G communication, millimeter-wave radar, and IoT devices, the design quality of RF PCBs, which are the core of signal transmission and processing, directly determines the performance boundaries of the entire system. Once regarded as a ‘black art’ reliant on experience, RF design often required engineers to go through repeated trial … Read more