die attach

Introduction to Semiconductor Packaging (7): Die Attach Process

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Introduction to Semiconductor Packaging (7): Die Attach Process

In the previous content of this packaging series, the author briefly introduced packaging processes such as RDL, TSV, and hybrid bonding. Next, the author plans to write two more articles about semiconductor packaging processes, which will briefly introduce the die attach process and underfill process, after which we will delve into the second major part … Read more

Understanding Chip Packaging Processes (Traditional Packaging)

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Understanding Chip Packaging Processes (Traditional Packaging)

In the previous issue, we introduced some background knowledge about chip packaging:A Beginner’s Guide to Chip PackagingIn this issue, we will focus on the specific process of packaging.As previously mentioned, there are many forms of packaging, including traditional and advanced packaging.Different packaging types have different processes and techniques. After completing the entire write-up, I found … Read more