Packaging materials are key materials used to wrap and protect integrated circuit chips from damage caused by external environments such as moisture, dust, chemicals, and mechanical shocks. For common discussions, click above to follow and set as a star! 1. The Status and Advantages of Plastic Packaging According to the different types of packaging materials, … Read more
This article was published in 2024 by Binghamton University, State University of New York, and Nagase Industrial Co., Ltd. Advantages of Organic Interposers (from Kimi): An organic interposer is a component used in semiconductor packaging technology that provides electrical interconnections between chips (such as CPUs or GPUs) and the package substrate. Compared to traditional silicon … Read more
From Mechanical Strain to Energy Conversion The world of sensing technology is vast and boundless. The previous article laid a solid foundation based on changes in electrical parameters. Here, physical laws are applied in a more direct and sometimes more ingenious way: the elastic deformation of solids, the dynamic characteristics of fluids, the transfer and … Read more
Compared to single-sided and double-sided boards, the process flow of rigid multilayer printed circuit boards is fraught with challenges, with significantly increased difficulty, mainly reflected in the following aspects: 1.Inter-layer alignment of multilayer wiring 2.Alignment of holes with inner layer patterns 3.Step slot formation 4.Warping of the board surface 5.Defects such as internal delamination, bubbling, … Read more
When we submit PCB production data for prototyping, there is an option regarding the Tg value of the material on the online prototyping pricing page of the board factory. Different Tg values will affect the final prototyping costs, which means you have to pay for the Tg value of the material. So, what is this … Read more