Introduction to Semiconductor Packaging Processes and Equipment

Introduction to Semiconductor Packaging Processes and Equipment

Follow our official account, click the top right corner of the homepage “ ··· ”, set a star mark, and stay updated with the latest news in the smart vehicle industry. The semiconductor manufacturing process can be divided into front-end and back-end processes. The front-end process mainly involves wafer manufacturing, while the back-end process primarily … Read more

Introduction and Usage of the PCB Height Detection Function in Fuji NXT SMT Pick and Place Machine

Introduction and Usage of the PCB Height Detection Function in Fuji NXT SMT Pick and Place Machine

The PCB height detection function of the NXT pick and place machine is a feature that measures the warpage of the circuit board transported onto the transport track. For circuit boards with warpage, in addition to ensuring stable component placement, if the warpage exceeds the tolerance value, please avoid production in advance to prevent the … Read more