Have you discovered the options for “Share” and “Like”? Click here to check it out. ＊ Preliminary Review From 0 to 1: A Detailed Breakdown of the SAW Wafer Fabrication Process (Part 1 – Photolithography) From 0 to 1: A Detailed Breakdown of the SAW Wafer Fabrication Process (Part 2 – Thin Film Etching) The … Read more
Click the blue textFollow us Every semiconductor product requires hundreds of processes. The Lam Group divides the entire manufacturing process into eight steps: wafer processing – oxidation – photolithography – etching – thin film deposition – interconnection – testing – packaging. Step 1: Wafer Processing ① Ingot Casting First, sand must be heated to separate … Read more
Senhui Introduction: Suzhou Senhui Semiconductor, supported by a strong research and technology team, focuses on providing complete process solutions and wafer fabrication services for global compound semiconductor customers. The company team members have deep experience in the semiconductor industry, with decades of rich capabilities in photolithography, thin film processes, epitaxy, bonding processes, as well as … Read more
Have you discovered the options for “Share” and “Like”? Click here to check it out. Last Issue Review From 0 to 1: A Comprehensive Breakdown of the SAW Wafer Fabrication Process (Part 1 – Photolithography) Reshaping the Body – Thin Film Deposition While beautiful appearances are commonplace, interesting souls are rare. In the life spectrum … Read more
#04Equipment and Materials4.1 Key Equipment Photolithography Machine: As the core equipment in the fabrication process, its precision and stability have a decisive impact on the quality of chip pattern transfer. Modern photolithography machines utilize advanced optical systems and precise mechanical structures to project layout patterns onto silicon wafers with extremely high resolution, enabling the accurate … Read more
The design of BGA (Ball Grid Array) on PCB boards is very common in the industry, and the issue of irregular BGA sizes can severely affect the soldering quality and electrical performance of PCBs. To effectively improve this issue, it is necessary to address it from the aspects of design and manufacturing processes.1. Package Design1. … Read more
Source: Fresh Date Classroom Original Author: Little Date Jun This article mainly introduces the process of chip manufacturing. Oxidation First, on the wafers that have been cut and polished, we need to perform an oxidation step. The purpose of oxidation is to form a protective film (oxide layer) on the fragile surface of the wafer. … Read more
Yangzhou Lattice Semiconductor specializes in providing high-purity, large-size single crystal silicon & polycrystalline silicon materials, and can perform deep processing customization such as cutting, grinding, polishing, and drilling, including silicon wafers, silicon components, silicon target materials, silicon seed crystals, silicon electrodes, silicon rings, silicon window pieces, and other silicon products. The etching technique is a … Read more
1. Introduction The copper in the vias of a printed circuit board (PCB) is akin to the neural network (blood vessels) of the human body, interspersed within the substrate “body” to provide the basic pathways for signal transmission and current conduction. Once a via copper break occurs, it is like a nerve being severed, preventing … Read more
The PCB industry chain is structured as follows: Upstream Raw Materials — Midstream Substrates — Downstream PCB Applications Upstream Raw Materials Upstream raw materials include copper foil, resin, fiberglass cloth, wood pulp, ink, and copper balls, among which copper foil, resin, and fiberglass cloth are the three main raw materials. Copper foil is the primary … Read more