Driven by the continuous wave of technological advancement, TaiLing Microelectronics has achieved new breakthroughs in chip technology with the recent launch of the TL721X and TL751X. These chips are equipped with highly integrated self-developed IP that enhances edge computing capabilities and leads the industry with their ultra-low power chip design. Both chips support Machine Learning and Artificial Intelligence, paving a new path for the future development of intelligent applications and injecting continuous vitality. Since its inception in 2010, TaiLing Microelectronics has consistently focused on the vast field of wireless IoT chip technology, and through relentless efforts, has achieved remarkable results. The global cumulative shipment of its chips has surpassed 2 billion units, marking a significant milestone that demonstrates TaiLing Microelectronics’ strong capabilities in market competition, as well as the high reliability and stability inherent in its chip technology.
The TL721X, as the first ultra-low power multi-protocol IoT wireless SoC chip in China to achieve a working current as low as 1mA, has realized comprehensive and multi-level optimization upgrades based on the solid foundation of TaiLing Microelectronics’ previous TLSR9 product family. It cleverly integrates several cutting-edge innovative technologies, precisely targeting and excellently meeting the more stringent and diverse high standards required by the next generation of high-performance IoT terminal products for core chips. The TL751X, on the other hand, stands out in the wireless audio SoC field with its unique high performance, multi-protocol support, and high integration characteristics. This chip adopts an advanced multi-core design concept, integrating HiFi-5 DSP, which results in extremely powerful computing processing capabilities and incorporates a rich variety of practical functional modules.
These two chips significantly promote innovation and development in AI applications across multiple fields.
Smart Audio: In consumer audio devices, the TL751X supports high-quality audio transmission for devices such as headphones with its high performance, multi-protocol, and high integration. It also leverages powerful computing capabilities to enhance smart voice interaction, such as intelligently switching audio modes via voice commands. The TL721X, with its low power consumption and AI noise reduction algorithms, accurately identifies and suppresses environmental noise. In audio conferencing systems, the TL751X processes multiple audio streams, utilizing AI to achieve high-definition calls, mixing, and intelligent voice command responses, such as automatically recording key points. In automotive audio systems, the TL751X intelligently adjusts audio based on driving scenarios, enhancing bass at high speeds and optimizing navigation in congested areas. In multi-user intercom systems, both chips collaborate, optimizing networking with AI to achieve a low-latency, high-stability, and flexible Mesh network for 24 users, with duplex communication for 4 users. Previously, a 5-user duplex system was recognized and served as a foundation for development, promoting the innovative development and widespread application of smart audio powered by AI.
Smart Home: The high performance, low latency, and low power characteristics of the TL721X and TL751X make smart voice assistants more fluid and natural, allowing users to conveniently control devices such as lights, curtains, and air conditioners via voice commands. Support for Matter enables seamless connectivity of devices with different protocols, while the low power advantage ensures long-lasting operation. The rich peripheral interfaces connect sensors, and with the help of AI algorithms (LiteRT, TVM, etc.), intelligent perception learning and control of indoor environments can be achieved, enhancing living comfort. Currently, TaiLing Microelectronics is leading the industry in the application of Matter+ML/AI in smart homes.
Smart Wearables: Smartwatches and wristbands, leveraging the low power characteristics of the TL721X and TL751X, can operate stably for extended periods, continuously monitoring users’ exercise and health data. With the help of AI algorithms, they can deeply analyze complex data such as exercise posture, sleep quality, and heart rate variability, providing users with highly personalized health advice and exercise guidance. Additionally, using machine learning models, they support voice or gesture interaction, making operations more convenient and efficient, thus enhancing the overall user experience.
Smart Healthcare: In the field of smart healthcare, the TL721X and TL751X, with their advanced microprocessor architecture and efficient signal processing capabilities, provide innovative solutions for mobile health monitoring. These two chips integrate low-power Bluetooth communication protocols, supporting seamless connectivity with various medical sensors, such as heart rate monitors, blood pressure monitors, and blood glucose meters. They can analyze the collected data locally using edge AI computing, ensuring user privacy while utilizing machine learning technology to provide users with relevant reminders and medical services.
Location Services: The TL721X and TL751X support the latest Bluetooth 6.0 channel sounding for high-precision positioning combined with environmental Bluetooth beacons, providing high-precision indoor positioning and navigation services in large venues such as shopping malls, airports, and hospitals, helping users quickly find their destinations and enhancing operational efficiency and user experience. For enterprise fixed asset management, such as equipment and goods tracking, both chips can obtain real-time location information and transmit it to management systems, utilizing AI algorithms and machine learning to analyze asset movement trajectories and usage status, achieving intelligent tracking and management, improving asset utilization, and reducing loss risks.
Smart Remote Control: The multi-protocol concurrent mode supported by the TL721X and TL751X endows remote controls with stronger device compatibility and collaborative capabilities. In complex smart entertainment scenarios such as home theaters, users can easily control various types of smart devices like TVs, sound systems, and projectors with just one remote control. With the help of machine learning, devices can achieve efficient and seamless collaboration, fully meeting users’ diverse entertainment needs, significantly enhancing the overall quality and convenience of the smart entertainment experience while achieving low power consumption and reducing battery replacement for green energy-saving goals.
Industrial Sensing: In industrial production, both chips can collect sensor data in real-time, using AI algorithms for data analysis and modeling to predict equipment failures (Anomaly Detection), achieving preventive maintenance, reducing downtime, and improving production efficiency while lowering maintenance costs. The multi-protocol communication function connects different industrial devices into a network, comprehensively analyzing data to optimize production processes and adjust process parameters, promoting the intelligent upgrade of industrial production.
Continuing the product development of TL721X and TL751X, TaiLing Microelectronics adheres to an unwavering pursuit of technological innovation and a firm belief in future development. The future direction of chip development will consistently integrate machine learning and AI hardware and software technologies, guided by the expansion of intelligent application fields, actively exploring and developing broader market space, and contributing its wisdom and strength to comprehensively promote the intelligent transformation and upgrading of various industries. Currently, the TL721X has entered a critical stage of mass production preparation, expected to officially commence large-scale production in mid-2025, and has already provided samples to some leading customers for preliminary testing and evaluation. The TL751X, with its outstanding high performance, extensive multi-protocol support, and excellent high integration advantages, has already emerged in the market, poised to meet the diverse and personalized needs of different customer groups, working together with customers to outline a grand blueprint for intelligent applications.
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