Rapidus Provides Version 0.5 of 2nm PDK, Tenstorrent Aims for Tape-out of Collaborative Chip This Year

Rapidus Provides Version 0.5 of 2nm PDK, Tenstorrent Aims for Tape-out of Collaborative Chip This Year

On April 21, news emerged that AI chip company Tenstorrent held the opening ceremony of its Tokyo office on the 17th of this month. The company’s CEO and renowned chip designer Jim Keller attended the event in Japan and also visited its partner Rapidus located in Hokkaido. During a press conference, Jim Keller stated that … Read more

16nm FinFET AI Chip Tape-Out Summary

16nm FinFET AI Chip Tape-Out Summary

This project began around the same time last year, and after a year of “process flow”, we finally received the PDK and digital library 20 days before tape-out. One cannot help but marvel at the efficiency of the team. It took a week to familiarize myself with the process, and the tape-out design was completed … Read more

Advancements in GaN Technology II: The First 100nm High-Performance GaN Wafer PDK Platform in China

Advancements in GaN Technology II: The First 100nm High-Performance GaN Wafer PDK Platform in China

Jiufengshan Laboratory GaN PDK R&D Team Jiufengshan Laboratory GaN Series Achievements II Recently, Jiufengshan Laboratory released the first 100 nm silicon-based GaN commercial Process Design Kit (PDK) in China, with performance indicators reaching domestic leading and international top levels. As the second commercial solution globally and the first in China, its technical specifications support high-throughput … Read more