Domestic Chip Design Companies Break Through in Tape-Out

Domestic Chip Design Companies Break Through in Tape-Out

Click the blue text to follow us From a single chip to mass production, tape-out determines whether the chip design can be utilized. Each successful tape-out signifies a successful chip design. Since the beginning of this year, many domestic companies have announced successful tape-outs, which undoubtedly demonstrate significant progress in domestic chip development. In the … Read more

The Semiconductor Jargon World: A Guide from Tape-Out to Packaging Testing

The Semiconductor Jargon World: A Guide from Tape-Out to Packaging Testing

Hello everyone, I am Chip Language. Today, let’s dive into the world of chip cultivation—from design to mass production, chips must go through numerous challenges: Tape-Out is the foundation, packaging testing is the tribulation, and yield is the ascension KPI… The fate of engineers is to protect the chips while sacrificing their hair for merit. … Read more

What is the NRE Stage of MEMS Wafer Fabrication? What is the Relationship Between MPW and NRE?

What is the NRE Stage of MEMS Wafer Fabrication? What is the Relationship Between MPW and NRE?

Source: Chip Learning Original Author: Chip Future The semiconductor wafer fabrication NRE refers to “Non-Recurring Engineering” costs, which are one-time expenses incurred during the chip development process. These costs cover a series of non-recurring work from chip design to the successful first wafer fabrication, including design and R&D expenses, mask production costs, process development and … Read more