In semiconductor manufacturing, there is a technology known as “Global Planarization Unique Solution”—it can reduce the roughness of silicon wafer surfaces to the nanometer level, allowing for precise etching of 7nm and 5nm circuits; in computer hard drives, it enables the flying height of the read/write head to be as low as 10nm without scratching … Read more
In chip manufacturing, there is an “invisible hero”—without it, multi-layer metal circuits would resemble “uneven mountain roads,” making precise lithography impossible, and achieving 7nm or 5nm processes would be a fantasy. This hero isChemical Mechanical Polishing (CMP), which can control the surface undulations of silicon wafers within 50Å (0.005μm), achieving true “global flattening.” Today, we … Read more
Behind the 7nm circuits of mobile phone chips and the 10nm flying height of computer hard disk heads lies a key technology – Chemical Mechanical Polishing (CMP). It is currently the only process capable of achieving “global planarization” of silicon wafers. Without it, the reduction in device size and multilayer interconnections would become a “castle … Read more
This article is based on interviews with Wu Lingxiang and Ye Guoguang from Taiwan. Rare earth elements play an indispensable role in semiconductor manufacturing, especially in advanced process nodes, high-precision equipment, and critical materials. China’s export controls on related rare earth materials have caused varying degrees of potential impact on the global semiconductor industry, among … Read more
1. Company Overview of Jingyuda In the past, this process was tightly controlled by international giants: expensive equipment, closed processes, and long lead times for spare parts, often leading to “production line waiting for parts.” Now, in response to the domestic substitution demand for semiconductor equipment and the low domestic rate, a group of semiconductor … Read more
Design Case (40mm Annular Control Board) This application design simplifies and optimizes the sensorless control algorithm for Brushless Direct Current (BLDC) motors, which is typically implemented by Digital Signal Controllers (DSC) or high-end 16/32-bit microcontrollers. It achieves complete control functionality on the New Tang enhanced 1T 8051 core microcontroller, highlighting the overall cost-performance ratio of … Read more
In semiconductor fabs, the PVD, CVD, and CMP modules are collectively referred to as the thin film department. Following this convention, I will discuss these three types of equipment together. From the name thin film, it is clear that these three types of equipment are used for the deposition of thin films and for the … Read more