Chemical Mechanical Polishing (CMP): The Only Process That Can Achieve a “Mirror Finish” on Silicon Wafers, Current Status and Challenges
Behind the 7nm circuits of mobile phone chips and the 10nm flying height of computer hard disk heads lies a key technology – Chemical Mechanical Polishing (CMP). It is currently the only process capable of achieving “global planarization” of silicon wafers. Without it, the reduction in device size and multilayer interconnections would become a “castle … Read more